EP3CLS70F484C8

The EP3CLS70F484C8 is an Intel Cyclone® III field-programmable gate array (FPGA) supplied in a 484‑ball FBGA (23×23) surface-mount package. It delivers 70,208 logic elements and approximately 3.07 Mbits of embedded memory, paired with 278 user I/Os for high-density, I/O-rich designs.

As part of the Cyclone III device family, this device targets cost-sensitive, low-power applications where integration, flexible I/O, and commercial-temperature operation (0 °C to 85 °C) are required. The family-level design emphasizes low static power and silicon-level optimizations for power efficiency.

Key Features

• Core architecture Based on the Cyclone III device family, offering a balance of functionality and low-power operation as described in the device handbook.
• Logic capacity 70,208 logic elements to implement medium-to-large custom logic and glue logic functions.
• Embedded memory Approximately 3.07 Mbits of on-chip RAM suitable for buffering, packet staging, and local data storage.
• I/O resources 278 user I/Os to support multiple parallel interfaces and dense connector designs.
• Clock management Cyclone III family devices include robust clocking resources for system and interface clock synthesis and distribution.
• Power and supply Core supply range specified at 1.15 V to 1.25 V to match system power rails and low-power design targets.
• Package and mounting 484‑FBGA (23×23) surface-mount package for compact board integration and high pin count in a single footprint.
• Operating environment Commercial grade operation from 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• Portable and handheld devices Low-power Cyclone III silicon and compact 484‑BGA packaging suit battery-powered products where board area and power budget are constrained.
• Consumer electronics and multimedia On-chip memory and extensive I/O enable user-interface control, data buffering, and custom peripheral glue logic.
• Communications and networking equipment High I/O count and flexible clocking support interface bridging, protocol handling, and packet processing tasks.
• Embedded systems and prototyping Large logic capacity and embedded memory make this device useful for proof-of-concept designs and custom embedded accelerators.

Unique Advantages

• High logic density: 70,208 logic elements provide substantial on-chip resources for complex finite-state machines, datapaths, and control logic without external programmable devices.
• Significant on-chip memory: Approximately 3.07 Mbits of embedded RAM reduces the need for external memory in many buffer and caching applications.
• Rich I/O capability: 278 user I/Os support multiple parallel interfaces, easing integration with sensors, transceivers, and high-pin-count connectors.
• Low-power family heritage: Cyclone III devices were developed with TSMC low-power process and power-aware design techniques to address power-sensitive designs.
• Compact, high-density package: 484‑FBGA (23×23) delivers a high pin-count solution in a compact surface-mount form factor for dense PCB layouts.
• Commercial temperature suitability: Specified operation from 0 °C to 85 °C for standard commercial deployments.

Why Choose EP3CLS70F484C8?

The EP3CLS70F484C8 combines the Cyclone III family’s low-power design approach with substantial logic and memory resources and a high count of user I/Os. Its 484‑FBGA package and surface-mount mounting make it practical for space-constrained PCBs while retaining the integration needed for complex digital functions.

This part is well suited to engineers building cost-sensitive, power-aware systems that require medium-to-large FPGA capacity and significant on-chip memory, backed by the Cyclone III device family characteristics documented in the device handbook.

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