EP3CLS70F780C7

The EP3CLS70F780C7 is a Cyclone® III Field Programmable Gate Array in a 780-FBGA (29×29) surface-mount package. It provides 70,208 logic elements, approximately 3.07 Mbits of embedded memory and 413 user I/Os, delivering a balance of integration and capacity for mid-to-high density designs.

Built on the Cyclone III device family architecture, this device targets cost- and power-sensitive applications that require significant on-chip logic and memory while maintaining a commercial operating temperature range and RoHS compliance.

Key Features

• Core density  70,208 logic elements to implement complex combinational and sequential logic while keeping board-level routing manageable.
• Embedded memory  Approximately 3.07 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory.
• I/O capacity  413 user I/Os for high-density peripheral, interface, and bus connections on a single device.
• Power supply  Core voltage range 1.15 V to 1.25 V to match system power rails and power budgeting needs.
• Package & mounting  780-FBGA (29×29) surface-mount package designed for compact, high-density PCB layouts.
• Operating range  Commercial grade operation from 0 °C to 85 °C for standard consumer and industrial-adjacent environments.
• Standards & compliance  RoHS compliant to support modern regulatory and manufacturing requirements.
• Cyclone III family capabilities  As part of the Cyclone III family, the device aligns with the family’s low-power design goals and device-level features such as multiple PLLs for flexible clock management (family-level characteristic).

Typical Applications

• Portable and handheld equipment  On-chip memory and logic density help reduce external components and extend battery life in power-sensitive devices.
• Communications and networking  High I/O count and substantial logic resources enable protocol bridging, packet processing, and I/O aggregation tasks.
• Consumer electronics  Integration of logic and embedded memory supports display controllers, media processing front-ends, and custom peripherals.
• Embedded control and instrumentation  Local processing, buffering, and flexible I/O permit compact control subsystems and sensor interfacing in thermally-challenged environments.

Unique Advantages

• High logic capacity: 70,208 logic elements provide the resources to consolidate multiple functions into a single FPGA, reducing board-level complexity.
• Significant on-chip memory: Approximately 3.07 Mbits of embedded RAM reduce dependence on external memory, improving latency and simplifying BOM.
• Large I/O footprint: 413 user I/Os enable dense peripheral integration and flexible interface routing without additional I/O expanders.
• Compact BGA package: 780-FBGA (29×29) surface-mount packaging supports high-density PCB designs while maintaining thermal and signal routing options.
• Commercial temperature rating: 0 °C to 85 °C suits standard consumer and many industrial-adjacent deployments.
• Regulatory readiness: RoHS compliance aligns with current manufacturing and environmental requirements.

Why Choose EP3CLS70F780C7?

The EP3CLS70F780C7 delivers a balanced combination of logic density, embedded memory, and I/O capacity in a compact 780-FBGA package, making it well suited for designers building mid- to high-density, cost- and power-conscious systems. Its Cyclone III family heritage brings family-level benefits such as low-power design emphasis and flexible clock management.

This device is ideal for teams seeking to consolidate functionality, reduce external components, and streamline board-level design while relying on a commercial-grade FPGA offering from Intel’s Cyclone III family.

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