EP3CLS70F780C8N

The EP3CLS70F780C8N is a Cyclone® III field programmable gate array (FPGA) optimized for low-power, high-functionality designs. It combines a substantial logic capacity with on-chip memory and a high I/O count to support complex glue-logic, signal processing, and system-integration tasks in commercial applications.

Built on the Cyclone III family architecture, this device targets cost- and power-sensitive designs that require significant programmable logic, embedded memory, and flexible clocking while maintaining a commercial temperature rating and surface-mount packaging.

Key Features

• Logic Capacity — 70,208 logic elements provide the programmable resources to implement sizable custom logic functions and state machines.
• Embedded Memory — Approximately 3.07 Mbits of on-chip RAM to support FIFOs, buffers, and intermediate data storage without external memory.
• I/O Resources — 413 user I/Os to interface with peripherals, sensors, and high-pin-count system buses.
• Clock Management — Cyclone III family features include dedicated PLLs for robust clock synthesis and distribution.
• Power — Designed with low-power process optimizations; nominal core supply range is 1.15 V to 1.25 V to match low-voltage system domains.
• Package & Mounting — 780-ball FBGA (29 × 29) surface-mount package (780-BGA) suitable for compact PCB implementations.
• Operating Conditions — Commercial grade operation from 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

• Portable and Handheld Systems — Low-power family characteristics help extend battery life in compact devices that require moderate programmable logic and on-chip memory.
• High-Density I/O Interfaces — With 413 I/Os, the device is suited to front-end aggregation, protocol bridging, and custom interface logic for I/O-constrained boards.
• Embedded System Integration — Significant logic and embedded RAM support integration of glue logic, preprocessing, and control functions within a single FPGA.
• Thermally Challenged Environments — Low-power design attributes enable operation in designs where cooling resources are limited.

Unique Advantages

• Substantial Logic Resources: 70,208 logic elements enable complex state machines, datapath logic, and control functions without immediate recourse to multiple devices.
• On-Chip Memory: Approximately 3.07 Mbits of embedded RAM reduce dependence on external memory for buffering and temporary storage, simplifying BOM and PCB layout.
• High I/O Count: 413 user I/Os provide flexibility to connect multiple peripherals, buses, and interfaces directly to the FPGA.
• Low-Voltage Core: 1.15 V to 1.25 V core supply aligns with modern low-voltage system architectures for efficient power delivery.
• Compact Surface-Mount Package: 780-FBGA (29 × 29) packaging offers a high-pin-count solution in a compact footprint for dense board designs.
• RoHS-Compliant: Environmentally conscious manufacturing compliance for modern product requirements.

Why Choose EP3CLS70F780C8N?

The EP3CLS70F780C8N positions itself as a versatile, low-power Cyclone III FPGA option for commercial designs that require a balance of sizable logic capacity, embedded memory, and extensive I/O in a compact surface-mount package. Its combination of 70,208 logic elements, approximately 3.07 Mbits of on-chip RAM, and 413 I/Os makes it suitable for system integration tasks that reduce BOM complexity and simplify board-level design.

Choose this device when you need scalable programmable logic resources backed by Cyclone III family features such as dedicated clock management and low-power process optimizations, all within a commercial temperature range and RoHS-compliant construction.

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