EP3CLS70F780I7

The EP3CLS70F780I7 is a Cyclone® III family field‑programmable gate array (FPGA) in a 780‑ball BGA package. It delivers a high‑functionality, low‑power FPGA platform with approximately 70,208 logic elements, roughly 3.07 Mbits of embedded memory, and 413 user I/Os for system integration in cost‑sensitive and power‑aware designs.

Designed to serve high‑volume, low‑power applications and industrial environments, this device combines on‑chip memory, clock management, and broad I/O support with an operating range and voltage supply suited to embedded and industrial systems.

Key Features

• Logic Capacity  Approximately 70,208 logic elements to implement complex digital logic and control functions.
• On‑chip Memory  Approximately 3.07 Mbits of embedded memory for buffering, state storage, and local data manipulation.
• I/O Density  413 user I/Os to support high‑pin‑count interfaces and dense connectivity on modern PCBs.
• Power Supply  Core voltage range 1.15 V to 1.25 V, enabling operation within defined low‑voltage design margins.
• Package & Mounting  780‑FBGA (29 × 29) package, surface mount, suitable for compact board layouts.
• Temperature Range  Rated for operation from −40 °C to 100 °C, supporting industrial application environments.
• Low‑Power Family Attributes  Cyclone III family characteristics include low‑power process optimizations and power‑aware design flow that reduce static power consumption.
• Clock Management  Cyclone III family devices provide integrated PLL resources for clock synthesis and management (family feature).
• I/O Standard Support  Cyclone III family supports a broad set of I/O standards and adjustable I/O slew rates to aid signal integrity and interface flexibility (family feature).
• Compliance  RoHS‑compliant material declaration for environmental regulatory adherence.

Typical Applications

• Portable and Handheld Devices  Low‑power Cyclone III family characteristics help extend battery life and reduce cooling needs in compact systems.
• Industrial Control  Industrial temperature rating (−40 °C to 100 °C) and ample I/O density suit factory automation and control electronics.
• Communications and I/O‑Heavy Systems  High I/O count and on‑chip memory enable dense interface handling, protocol bridging, and data buffering.
• Embedded Processing Platforms  On‑chip memory and logic resources support custom soft cores or peripheral offload functions for embedded systems.

Unique Advantages

• High integration density: Consolidates complex logic and buffering with ~70,208 logic elements and ~3.07 Mbits of embedded memory to reduce external components.
• Broad I/O flexibility: 413 user I/Os and family support for multiple I/O standards simplify interfacing to diverse peripherals and high‑speed links.
• Industrial suitability: Specified operating range from −40 °C to 100 °C and surface‑mount 780‑BGA packaging support rugged embedded deployments.
• Low‑voltage core: 1.15 V–1.25 V core supply supports modern low‑power system architectures and power budgeting.
• Power‑aware family features: Cyclone III device family optimizations for low power help reduce static power consumption in mass‑production designs.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP3CLS70F780I7?

The EP3CLS70F780I7 places Cyclone III family capabilities—substantial logic resources, multi‑megabit embedded memory, and a high I/O count—into a compact 780‑BGA footprint rated for industrial temperatures. It is well suited for design teams targeting cost‑ and power‑sensitive systems that require significant on‑chip integration and flexible interfacing.

For projects where board area, power budget, and reliable operation across a broad temperature range matter, this device offers a balance of capacity, integration, and family‑level low‑power features that ease system design and long‑term product support.

If you would like pricing, availability, or to request a formal quote for EP3CLS70F780I7, submit a request and a sales specialist will follow up to assist with procurement and technical questions.