EP3CLS70F780I7N

The EP3CLS70F780I7N is an Intel Cyclone® III field-programmable gate array (FPGA) offered in a 780‑ball FBGA (29×29) package. It combines mid-range logic capacity with a high I/O count and industrial operating range for designs that require flexible, reprogrammable logic in thermally and electrically constrained environments.

As a Cyclone III family device, it leverages low‑power process technology and family-level system features to deliver integration and power efficiency for industrial, embedded, and communications applications.

Key Features

• Logic Capacity  70,208 logic elements provide substantial programmable fabric for custom logic, state machines, and glue‑logic functions.
• Embedded Memory  Approximately 3.07 Mbits of on‑chip RAM to support buffering, FIFOs, and small lookup tables without external memory.
• I/O Density & Package  413 user I/Os in a 780‑FBGA (29×29) surface‑mount package enable high pin‑count designs with compact board area.
• Power & Voltage  Device supply range of 1.15 V to 1.25 V and family‑level low‑power process optimizations to help meet tight power budgets.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation for reliable performance in industrial environments.
• Clock Management  Cyclone III family devices include multiple PLLs (four PLLs per device with five outputs each) for robust clock synthesis and routing.
• Family-Level Integration Features  Cyclone III device family supports a wide range of I/O standards, adjustable I/O slew rates, OCT calibration for on‑chip termination, and high memory‑to‑logic ratios for system consolidation.
• Surface Mount Assembly  780‑ball FBGA surface‑mount package (supplier package: 780‑FBGA, 29×29) simplifies board placement and thermal management.

Typical Applications

• Industrial Control  Programmable logic and high I/O count make the device suitable for motor control logic, sensor aggregation, and PLC interface functions within an industrial temperature window.
• Embedded Systems & Custom Peripherals  On‑chip memory and logic density allow implementation of custom accelerators, protocol converters, and Nios II‑style soft processor subsystems.
• High‑I/O Interface Hubs  Large user I/O complement supports multi‑lane I/O bridging, parallel sensor arrays, and mixed‑signal interface management using family I/O standards.
• Low‑Power Designs  TSMC low‑power process technology and Cyclone III power‑aware features suit thermally constrained and battery‑sensitive applications.

Unique Advantages

• Substantial Logic Density: 70,208 logic elements provide room to consolidate multiple functions on a single device and reduce BOM complexity.
• Integrated On‑Chip Memory: Approximately 3.07 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage.
• High Pin Count in Compact Package: 413 I/Os in a 780‑FBGA (29×29) deliver high connectivity while keeping board area small.
• Industrial Reliability: Rated for −40 °C to 100 °C, making the device suitable for industrial deployment where extended temperature range matters.
• Power‑Efficient Architecture: Built on low‑power process technology to help meet power budgets and ease thermal design.
• Flexible Clocking: Multiple PLLs with several outputs per PLL enable flexible clock management for complex multi‑domain systems.

Why Choose EP3CLS70F780I7N?

The EP3CLS70F780I7N positions itself as a mid‑range Cyclone III FPGA that balances programmable capacity, I/O flexibility, and industrial reliability. Its 70,208 logic elements, substantial embedded RAM, and 413 I/Os allow system designers to integrate more functionality on a single device and reduce board-level complexity.

For engineering teams designing industrial or embedded systems that require reprogrammable logic, robust clocking, and low‑power operation within a wide temperature range, this Cyclone III device provides a practical, well‑specified platform with long‑term support from the Cyclone III family documentation and toolchain.

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