EP3CLS70U484C8N

The EP3CLS70U484C8N is a Cyclone® III field programmable gate array (FPGA) offered in a 484‑FBGA package for surface‑mount applications. It delivers a high level of integration with 70,208 logic elements, a large I/O count, and on‑chip embedded memory—designed for high‑volume, low‑power, cost‑sensitive commercial applications.

As part of the Cyclone III device family, the device leverages low‑power process technology and family‑level architecture choices that emphasize efficiency, system integration and flexible I/O to simplify board‑level design and reduce component count.

Key Features

• Logic Core  70,208 logic elements to implement complex logic, glue logic, and custom peripherals.
• Embedded Memory  Approximately 3.07 Mbits of on‑chip RAM for buffering, state storage, and local data processing.
• I/O Capacity  278 user I/O pins to support dense external interfaces and multi‑lane connectivity in a single device.
• Power and Voltage  Operates from a core supply range of 1.15 V to 1.25 V; family documentation emphasizes low static power targets to support thermally constrained designs.
• Package & Mounting  484‑FBGA package (supplier package: 484‑UBGA, 19×19) in a surface‑mount form factor for compact PCB layouts.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C and specified as Commercial grade.
• RoHS Compliant  Conforms to RoHS requirements for lead‑free manufacturing environments.
• Cyclone III Family Capabilities  Family features include low‑power TSMC LP process optimizations, multiple PLLs for clock management, and a broad set of supported I/O standards and on‑chip system integration features.

Typical Applications

• High‑volume consumer products  Cost‑sensitive handheld and portable designs that benefit from low static power and high integration to reduce BOM and board area.
• Communications and networking  I/O‑dense front‑end and bridging applications where 278 user I/Os enable multiple external interfaces and protocol translation.
• Embedded control and processing  Local control, data buffering, and custom peripheral offload using the device’s logic capacity and on‑chip RAM.
• Compact system designs  Space‑constrained PCBs that require a high‑density FBGA package and surface‑mount assembly for reduced footprint.

Unique Advantages

• Highly integrated logic and memory: Combine 70,208 logic elements with approximately 3.07 Mbits of embedded RAM to reduce dependency on external components.
• Large I/O availability: 278 user I/Os provide flexibility to interface with multiple peripherals, sensors, and high‑speed links without extra bridging devices.
• Low core voltage operation: Narrow core supply range (1.15 V–1.25 V) supports predictable power budgeting for system power design.
• Compact, manufacturable package: 484‑FBGA (19×19 UBGA) supports surface‑mount assembly and high‑density routing for space‑optimized boards.
• Commercial readiness: Rated for 0 °C to 85 °C and RoHS compliant, suitable for mainstream commercial products and assemblies.
• Family ecosystem: Leverage Cyclone III family resources such as low‑power design flow and pre‑built IP to accelerate development and reduce integration effort.

Why Choose EP3CLS70U484C8N?

The EP3CLS70U484C8N balances significant logic capacity, substantial embedded memory, and a high I/O count in a compact 484‑FBGA footprint—making it a strong candidate for commercial designs that demand integration, low power, and predictable thermal behavior. Its family heritage emphasizes low static power and system integration features that help designers optimize board‑level BOM and thermal management.

This device is well suited to engineers developing cost‑sensitive, high‑volume products who need a scalable FPGA platform with available family‑level IP and design flow resources to accelerate time to market.

Request a quote or submit your requirements to receive pricing and availability for the EP3CLS70U484C8N. Our team can provide lead‑time guidance and support for volume procurement and design integration.