EP3CLS70U484I7N

The EP3CLS70U484I7N is a Cyclone III Field Programmable Gate Array (FPGA) optimized for low-power, high-functionality designs. Built on the Cyclone III device family architecture, it delivers a balance of logic density, on-chip memory and I/O capacity for cost-sensitive and industrial applications.

With 70,208 logic elements, approximately 3.07 Mbits of embedded memory and 278 I/Os in a 484-FBGA package, this device targets designs that require dense programmable logic, substantial on-chip RAM, and a broad I/O count while operating across an industrial temperature range.

Key Features

• Logic Capacity  70,208 logic elements provide substantial programmable logic resources for complex RTL implementations and custom state machines.
• Embedded Memory  Approximately 3.07 Mbits of on-chip RAM for buffering, packet storage, and local data processing without external memory.
• I/O Density & Flexibility  278 user I/Os available for high-pin-count interfaces and system integration; package supports dense board layouts with surface-mount mounting.
• Power Supply  Operates from a core supply range of 1.15 V to 1.25 V to match system power-rail design choices.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C, suitable for thermally challenged and industrial environments.
• Package  484-FBGA (supplier package 484-UBGA, 19×19) provides a compact, high-density footprint for board-level integration.
• Family-Level Advantages  As part of the Cyclone III family, the device benefits from low-power TSMC LP process optimizations, on-chip PLLs for clock management, and a collection of pre-built IP cores and the Nios II embedded processor available for system integration.
• Regulatory  RoHS compliant for environmental compliance in assembly and deployment.

Typical Applications

• Portable and Handheld Systems  Low-power family characteristics support extended battery life and operation in thermally constrained portable devices.
• Industrial Control and Automation  Industrial-grade temperature rating and high I/O count make the device suitable for controllers, motor drives and sensor aggregation.
• Communications and Interface Bridging  High logic density, on-chip memory and numerous I/Os enable protocol bridging, packet buffering and custom I/O subsystems.
• Embedded Processing and Custom Logic  On-chip memory and compatibility with Nios II and available IP cores simplify integration of embedded control, preprocessing and glue logic.

Unique Advantages

• High Logic and Memory Integration: Combines 70,208 logic elements with approximately 3.07 Mbits of embedded RAM to reduce reliance on external components and simplify BOM.
• Wide I/O Count: 278 user I/Os support complex multi-interface systems and dense peripheral routing without multiple devices.
• Industrial Temperature Rating: Rated –40 °C to 100 °C for reliable operation in demanding environmental conditions.
• Compact, Surface-Mount Package: 484-FBGA (19×19 UBGA) enables a compact PCB footprint while retaining high I/O density.
• Low-Power Family Technology: Benefits from Cyclone III low-power process optimizations for reduced static power consumption in volume deployments.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious manufacturing and deployment.

Why Choose EP3CLS70U484I7N?

The EP3CLS70U484I7N positions itself as a balanced solution for designs that require substantial programmable logic, meaningful on-chip memory and high I/O counts within an industrial temperature envelope. It leverages Cyclone III family characteristics—low-power process technology, clock management resources and an established IP ecosystem—to help reduce board-level complexity and accelerate development.

This device is well suited for engineering teams building industrial controls, communications interfaces, embedded preprocessing blocks, and portable systems where power, integration and board density are key considerations. Its combination of resources and family-level tool and IP support helps deliver scalable, production-ready designs.

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