EP3SE110F1152C2N

The EP3SE110F1152C2N is a Stratix® III E FPGA IC from Intel designed for high-density, programmable logic implementations. It combines a large logic fabric, substantial embedded memory, and abundant I/O in a compact FCBGA/FBGA package to support complex digital designs.

Targeted at commercial-grade applications, this device delivers approximately 107,500 logic elements, roughly 8.94 Mbits of embedded memory, and 744 general-purpose I/O pins, making it suitable for designs that require high integration and flexible on-chip resources.

Key Features

• High Logic Density — Approximately 107,500 logic elements provide a scalable programmable fabric for complex logic functions and custom datapaths.
• Embedded Memory — Approximately 8.94 Mbits of on-chip RAM supports large buffering, packet storage, and intermediate data processing without external memory.
• Extensive I/O — 744 I/O pins enable high-channel-count interfaces, parallel buses, and dense board-level connectivity.
• On-chip DSP and Clock Resources — The device documentation includes DSP block and PLL specifications, indicating integrated resources for signal processing and flexible clock management.
• Package and Mounting — 1152-FBGA (35×35) / 1152-BBGA FCBGA package with surface-mount mounting for compact PCB integration.
• Power and Operating Range — Core supply range from 860 mV to 1.15 V and a commercial operating temperature range of 0 °C to 85 °C.
• Standards and Compliance — RoHS-compliant manufacturing.

Typical Applications

• High-density logic systems — Use the device where large amounts of programmable logic are needed to implement custom hardware accelerators or complex control logic.
• On-chip buffering and memory-centric designs — The nearly 8.94 Mbits of embedded RAM supports packet buffering, line-rate processing, and intermediate data storage without immediate external memory.
• Multi‑interface and I/O‑rich boards — 744 I/O pins enable dense peripheral connectivity, parallel interfaces, and high-channel-count front-ends.

Unique Advantages

• Highly integrated programmable fabric: Large logic element count reduces the need for multiple discrete components and simplifies partitioning of complex designs.
• Substantial embedded memory: Approximately 8.94 Mbits of on-chip RAM minimizes dependence on external memory for many buffering and working‑memory tasks.
• Extensive I/O capacity: 744 I/Os support rich board-level connectivity and multiple simultaneous interfaces without multiplexing compromises.
• Compact surface‑mount package: 1152-FBGA (35×35) / 1152-BBGA FCBGA package enables high-density PCB layouts while maintaining a robust thermal and mechanical footprint.
• Flexible power operation: Core voltage range of 860 mV to 1.15 V allows designers to target different power profiles within recommended operating conditions.
• Commercial-grade reliability: Specified operation from 0 °C to 85 °C and RoHS compliance for standard commercial deployments.

Why Choose EP3SE110F1152C2N?

The EP3SE110F1152C2N positions itself as a high-density Stratix® III E FPGA suited for commercial applications that require extensive programmable logic, substantial embedded RAM, and a large number of I/O signals in a compact surface-mount package. Its combination of logic resources, on-chip memory, and documented on-chip DSP/PLL capabilities makes it a practical choice for designers implementing complex signal processing, parallel interfaces, or logic-heavy control systems.

This device is appropriate for design teams and OEMs seeking a scalable, commercially specified FPGA solution with clear electrical and operating parameters, including a defined core voltage range and operating temperature window.

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