EP3SE110F1152C2

The EP3SE110F1152C2 is a Stratix® III E field-programmable gate array (FPGA) in a 1152-ball FCBGA package. It offers high logic capacity, substantial on-chip memory, and a large I/O count for designs that require dense digital integration and flexible interfacing.

With a core supply range from 0.86 V to 1.15 V and commercial operating temperature from 0 °C to 85 °C, this device is suited for commercial-grade applications that demand significant programmable logic and memory resources in a compact surface-mount form factor.

Key Features

• Core Logic  107,500 logic elements provide substantial capacity for implementing complex digital functions and custom hardware acceleration.
• Embedded Memory  Approximately 8.9 Mbits of on-chip RAM supports large buffering, lookup tables, and state storage for high-density designs.
• I/O Density  744 user I/O pins enable extensive external interfacing for parallel buses, multi-channel peripherals, and high-pin-count connectors.
• Power Supply  Core voltage range of 0.86 V to 1.15 V accommodates typical Stratix III E power domains and system power architectures.
• Package and Mounting  1152-ball BGA (FCBGA / 1152-FBGA, 35×35) in a surface-mount package reduces PCB footprint while providing high-pin-count connectivity.
• Operating Range  Commercial grade temperature range from 0 °C to 85 °C for standard commercial-environment deployments.
• Environmental Compliance  RoHS-compliant construction supports regulatory requirements for lead-free assembly.

Typical Applications

• High-density digital systems  Implement complex logic functions and custom processors using 107,500 logic elements combined with on-chip memory.
• Multi‑channel interfacing  Large 744 I/O count supports designs requiring numerous external interfaces, parallel buses, or multi-lane I/O connectivity.
• Embedded memory‑intensive designs  Approximately 8.9 Mbits of embedded RAM enables buffering, packet storage, and state retention within a single device.

Unique Advantages

• High logic capacity: 107,500 logic elements allow implementation of complex, integrated digital subsystems without external glue logic.
• Substantial on-chip RAM: Approximately 8.9 Mbits of embedded memory reduces reliance on external memory components and simplifies PCB routing.
• Extensive I/O availability: 744 I/Os provide flexibility to connect multiple peripherals, sensors, or high‑pin-count connectors directly to the FPGA.
• Compact, high‑pin package: 1152-ball FCBGA (35×35) delivers high connectivity in a compact surface-mount form factor suitable for space-constrained boards.
• Commercial-grade readiness: Defined 0 °C to 85 °C operating range and RoHS compliance support standard commercial production and assembly processes.
• Flexible power domain: Core voltage support from 0.86 V to 1.15 V fits common FPGA power architectures for optimized system design.

Why Choose EP3SE110F1152C2?

The EP3SE110F1152C2 combines high logic density, significant embedded memory, and a very large I/O complement in a single commercial-grade FCBGA package. It is well suited to engineers and teams who need to consolidate complex digital functions and extensive interfacing into a compact, surface-mount FPGA solution.

This device provides a clear value for designs that prioritize on-chip resources and connectivity—delivering scalability for feature-rich systems while simplifying board-level integration through a high‑pin-count BGA package and RoHS-compliant construction.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the EP3SE110F1152C2. Our team can provide details to help you evaluate this FPGA for your next design.