EP3SE110F1152C3G

The EP3SE110F1152C3G is an Intel Stratix III family FPGA offered as a surface-mount FCBGA device. It delivers a high-density programmable logic platform suitable for high-performance logic, digital signal processing, and embedded designs.

Built on the Stratix III architecture and supported by family-level features such as selectable core voltage and advanced on-chip resources, this device targets applications that require significant logic capacity, embedded memory, and plentiful I/O in a compact package.

Key Features

• Logic Capacity  Approximately 107,500 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 8.94 Mbits of on-chip RAM to support buffers, FIFOs, and on-chip data storage.
• I/O Density  744 user I/Os providing flexible connectivity options for peripherals, memories, and interfaces.
• Package & Mounting  1152-BBGA (1152-FBGA, 35×35) package in a surface-mount form factor for high-density board integration.
• Power and Core Voltage  Device core supply range 0.86 V to 1.15 V, enabling power/performance tradeoffs during system design.
• Operating Conditions  Commercial grade device with operating temperature range 0 °C to 85 °C and RoHS compliance.
• Family-Level Timing & Clocking  Stratix III family features include multiple global, regional, and peripheral clocks and up to 12 PLLs for complex clocking schemes (family-level specification).
• DSP and High-Speed I/O Capabilities  Stratix III family devices provide dedicated high-speed DSP resources and SERDES support for high-throughput signal processing and communications (family-level specification).
• Security & Reliability  Series-level support for 256-bit AES encryption and configuration error detection and correction features to protect bitstreams and on-chip memory (family-level specification).

Typical Applications

• High-Performance Logic  Implement complex custom logic blocks and control systems where dense programmable resources and significant on-chip RAM are required.
• Digital Signal Processing  Leverage the device’s DSP-capable family architecture and embedded memory for filtering, modulation/demodulation, and real-time signal processing tasks.
• High-Speed Communications  Use the device’s SERDES and high I/O count to build interface bridging, protocol handling, and packet-processing functions.
• Memory Interface Controllers  Design DDR/DDR2/DDR3 and other external memory controllers using available on-chip logic and memory buffers (family-level interface support).

Unique Advantages

• High integration density: Combines roughly 107,500 logic elements with approximately 8.94 Mbits of embedded memory to reduce external component count and simplify board design.
• Substantial I/O capability: 744 user I/Os in a compact 1152-FBGA package provide routing flexibility for complex multi-channel systems.
• Flexible power scaling: Core voltage range of 0.86 V to 1.15 V supports power/performance tradeoffs for different system profiles.
• Commercial-grade, RoHS-compliant: Designed for commercial temperature ranges (0 °C to 85 °C) and meets RoHS environmental requirements.
• Proven family ecosystem: Stratix III family-level support for advanced clocking, DSP resources, AES security, and embedded processor IP enables faster system integration (family-level specification).

Why Choose EP3SE110F1152C3G?

The EP3SE110F1152C3G positions itself as a high-density Stratix III FPGA option for designers needing substantial logic and memory resources alongside a large I/O count in a surface-mount FBGA package. Its commercial-grade temperature range, RoHS compliance, and flexible core voltage range make it suitable for a broad set of high-performance embedded and signal-processing applications.

For teams building compute-, DSP-, or interface-heavy systems, this device provides a balance of logic capacity, embedded memory, and family-level features that support rapid integration and scalable designs backed by Intel’s Stratix III ecosystem.

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