EP3SE110F1152C3

The EP3SE110F1152C3 is a Stratix® III E field programmable gate array designed for commercial FPGA-based designs that require high logic density and substantial on-chip memory. It combines 107,500 logic elements with approximately 8.94 Mbits of embedded memory and a high I/O count to support complex, integration-focused applications.

Packaged in a 1152-FBGA (35×35) surface-mount package and operating across a low-voltage core supply range, this device is suited to commercial applications where integration density, I/O capacity, and power-conscious core operation are key selection criteria.

Key Features

• Core Logic  Provides 107,500 logic elements to implement complex digital logic, state machines, and custom architectures.
• Embedded Memory  Approximately 8.94 Mbits of on-chip RAM to support buffer storage, FIFOs, and memory-intensive logic functions.
• I/O Capacity  744 I/O pins to enable high-density external connectivity for parallel interfaces, data aggregation, and multi-channel designs.
• Package & Mounting  1152-BBGA / 1152-FBGA (35×35) package in a surface-mount form factor for compact board-level integration.
• Power  Core voltage supply range from 860 mV to 1.15 V to support low-voltage FPGA core operation and power-optimized designs.
• Commercial Grade & Temperature Range  Rated for commercial operation with an ambient range of 0 °C to 85 °C.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Commercial embedded systems  High logic density and substantial on-chip RAM enable complex control and data-processing functions in commercial devices.
• High-density I/O platforms  744 I/O signals support systems that require extensive external interfacing and parallel channel connectivity.
• Memory-dependent logic  Approximately 8.94 Mbits of on-chip RAM supports buffering, packet processing, and other memory-intensive tasks.

Unique Advantages

• High integration density: 107,500 logic elements reduce the need for external glue logic and consolidate complex functions on a single device.
• Substantial on-chip memory: Approximately 8.94 Mbits of embedded RAM enables larger local data stores and reduces external memory bandwidth requirements.
• Extensive I/O count: 744 I/O pins provide flexibility for multi-channel interfaces and high-pin-count system designs.
• Compact FCBGA package: 1152-FBGA (35×35) surface-mount package saves PCB area while supporting dense routing requirements.
• Low-voltage core support: 860 mV to 1.15 V supply range helps optimize power consumption for the core logic.
• Commercial qualification and RoHS compliance: Designed for commercial temperature ranges and RoHS-compliant manufacturing processes.

Why Choose EP3SE110F1152C3?

The EP3SE110F1152C3 positions itself as a high-density, memory-rich Stratix® III E FPGA suitable for commercial designs that demand large logic resources and significant on-chip RAM. Its combination of 107,500 logic elements, approximately 8.94 Mbits of embedded memory, and 744 I/O pins provides designers with the integration headroom needed to consolidate system functionality and simplify board-level architecture.

This device is well suited to customers developing commercial embedded systems and high-I/O platforms where compact packaging, low-voltage core operation, and RoHS compliance are important. The EP3SE110F1152C3 offers a scalable, integration-focused solution for reducing BOM complexity and supporting robust, long-life deployments in commercial environments.

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