EP3SE110F1152C4

The EP3SE110F1152C4 is a Stratix® III E field programmable gate array (FPGA) offered in a 1152‑BBGA (FCBGA) package. The device provides 107,500 logic elements and approximately 8.94 Mbits of embedded RAM, aimed at designs requiring substantial programmable logic and on‑chip memory.

With 744 I/O pins, a core supply range of 860 mV to 1.15 V, surface‑mount package, and a commercial operating range of 0 °C to 85 °C, this FPGA suits a range of commercial embedded and system applications where high integration and configurable logic density are required. The device is RoHS‑compliant.

Key Features

• Core Logic  107,500 logic elements providing the programmable fabric for custom logic, state machines, and signal processing implementations.
• Embedded Memory  Approximately 8.94 Mbits of on‑chip RAM to support buffering, FIFOs, and temporary data storage.
• I/O Density  744 available I/O pins to support parallel interfaces, multiple channels, and diverse peripheral connections.
• Power  Core supply range from 860 mV to 1.15 V, enabling low‑voltage operation of the FPGA core.
• Package & Mounting  1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35). Surface mount mounting type for PCB integration.
• Operating Conditions & Compliance  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental regulation alignment.

Unique Advantages

• High logic capacity: 107,500 logic elements allow implementation of complex logic, custom accelerators, and large state machines without external ASICs.
• Substantial on‑chip memory: Approximately 8.94 Mbits of embedded RAM reduces reliance on external memory for many buffering and data‑path needs.
• Extensive I/O count: 744 I/O pins support high channel counts and multiple parallel interfaces from a single device.
• Compact, board‑ready package: 1152‑BBGA (FCBGA) in a 35×35 supplier package provides a high‑density footprint for space‑constrained PCBs.
• Low‑voltage core support: Core supply range of 860 mV to 1.15 V enables integration into low‑voltage power domains common in modern designs.
• Commercial availability with RoHS compliance: Designed for commercial deployments where environmental compliance and standard operating ranges are required.

Why Choose EP3SE110F1152C4?

The EP3SE110F1152C4 positions itself as a high‑capacity Stratix® III E FPGA that balances large programmable logic resources, significant embedded memory, and a high I/O count in a compact FCBGA package. Its electrical and thermal parameters—860 mV to 1.15 V core supply and 0 °C to 85 °C operating range—make it suitable for commercial embedded systems that require dense logic and memory integration on a surface‑mount board.

This device is appropriate for teams and designs that need scalable programmable resources and a single‑chip approach to logic and data buffering, while maintaining RoHS compliance and standard commercial temperature support.

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