EP3SE110F1152C4LN

The EP3SE110F1152C4LN is a Stratix® III E field programmable gate array (FPGA) delivered in a high-density 1152-ball FCBGA package. It provides substantial on-chip logic and memory resources combined with a large I/O count for complex, highly integrated digital designs.

Key hardware attributes include 107,500 logic elements, approximately 8.9 Mbits of embedded memory, 744 user I/O, a 0.86–1.15 V core supply range, and commercial-grade operation from 0 °C to 85 °C. The device is RoHS compliant and designed for surface-mount assembly.

Key Features

• Programmable Logic Capacity  107,500 logic elements provide a substantial resource pool for implementing complex custom logic, state machines, and datapath functions.
• Embedded Memory  Approximately 8.9 Mbits of on-chip RAM supports buffering, packet processing, and memory-intensive algorithms without immediate dependence on external memory.
• Extensive I/O  744 user I/O pins enable broad connectivity for parallel interfaces, control signals, and heterogeneous peripherals.
• Power and Voltage  Core supply operation across 860 mV to 1.15 V accommodates system power architectures and core-voltage partitioning.
• Package and Mounting  Offered in a 1152-FBGA (35×35) supplier package / 1152-BBGA FCBGA package with surface-mount mounting for compact PCB implementation.
• Operating Range and Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C suitable for standard commercial applications.
• Environmental Compliance  RoHS compliant for environments requiring lead-free components.

Typical Applications

• High-density logic implementations  Use the large pool of logic elements to implement complex custom logic, protocol engines, and state machines on a single device.
• Memory-intensive on-chip processing  Approximately 8.9 Mbits of embedded RAM supports frame buffering, FIFO queues, and local data storage for real-time processing.
• I/O-rich interfacing  The 744 I/O pins accommodate parallel buses, custom control interfaces, and large peripheral sets without excessive external multiplexing.
• Compact surface-mount systems  The 1152-ball FCBGA package enables high-density board layouts where PCB area and assembly reliability are priorities.

Unique Advantages

• High logic density: 107,500 logic elements reduce the need for multiple devices by consolidating complex functions into a single FPGA.
• Substantial on-chip memory: Approximately 8.9 Mbits of embedded RAM minimizes reliance on external memory for many buffering and data-path tasks.
• Large I/O capacity: 744 I/O pins support extensive connectivity options, simplifying board-level routing and peripheral integration.
• Compact, surface-mount package: The 1152-FBGA (35×35) / 1152-BBGA FCBGA package enables dense PCB integration and professional assembly processes.
• Commercial readiness: Rated for 0 °C to 85 °C and RoHS compliant for broad commercial deployments.
• Low-voltage core support: Core supply range of 860 mV to 1.15 V aligns with contemporary power management schemes for digital systems.

Why Choose EP3SE110F1152C4LN?

The EP3SE110F1152C4LN positions itself as a high-capacity Stratix® III E FPGA option for designs that require large logic resources, significant on-chip memory, and a high I/O count within a compact surface-mount package. Its combination of 107,500 logic elements, approximately 8.9 Mbits of embedded RAM, and 744 user I/Os makes it suited to consolidating complex digital functions and interfaces into a single device.

This device is well suited for teams needing a commercially graded FPGA with a defined operating temperature range, RoHS compliance, and a high-density 1152-ball FCBGA package. It offers a pathway to reduce board-level component count and simplify integration for space-constrained commercial systems.

To request a quote or submit a procurement inquiry for EP3SE110F1152C4LN, please provide your quantity and delivery requirements and our team will respond with pricing and availability.