EP3SE110F1152I3N

The EP3SE110F1152I3N is a Stratix® III E Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1152‑FBGA (35×35) package. It delivers a high logic capacity with 107,500 logic elements and substantial embedded memory to support complex, configurable hardware designs.

Designed for industrial-grade applications, this device provides 744 I/O pins, an on-chip RAM capacity of approximately 8.94 Mbits, and a core supply range of 0.86 V to 1.15 V, operating across –40 °C to 100 °C for robust deployment in demanding environments.

Key Features

• Core Logic  Approximately 107,500 logic elements provide the programmable resources required for large-scale custom logic implementations and parallel processing architectures.
• Logic Array Blocks (LABs)  4,300 LABs support structured logic partitioning and design modularity for complex FPGA designs.
• Embedded Memory  Approximately 8.94 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Resources  744 general-purpose I/O pins enable wide external interfacing and high channel density for sensor, bus, and peripheral connections.
• Power  Core voltage support from 0.86 V to 1.15 V to match system power architectures and optimize core power consumption within specified supply limits.
• Package & Mounting  Supplier device package: 1152‑FBGA (35×35); package case: 1152‑BBGA, FCBGA. Surface-mount mounting for standard PCB assembly processes.
• Temperature & Grade  Industrial grade device rated for operation from –40 °C to 100 °C, suitable for industrial applications requiring extended ambient range.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Communications Infrastructure  Protocol handling and packet processing leveraging the large logic capacity and on-chip RAM for buffering and state machines.
• Video and Image Processing  Parallel processing pipelines and frame buffering implemented using abundant logic elements and embedded RAM.
• Industrial Control & Automation  Control logic, I/O aggregation, and sensor interfacing utilizing the device's industrial temperature rating and high I/O count.
• Data Acquisition & Test Equipment  High channel-count signal routing and custom data conditioning enabled by 744 I/O pins and flexible programmable logic.

Unique Advantages

• High Logic Capacity: 107,500 logic elements allow complex state machines, wide datapaths, and parallel compute architectures on a single device.
• Substantial On‑Chip Memory: Approximately 8.94 Mbits of embedded RAM reduces external memory dependency and simplifies board-level design.
• Extensive I/O Count: 744 I/O pins provide broad interfacing capability for multi-channel systems and dense peripheral connectivity.
• Industrial Temperature Range: Rated for –40 °C to 100 °C to support deployment in industrial environments with wider temperature swings.
• Compact, Surface‑Mount Packaging: 1152‑FBGA (35×35) package enables high-density PCB designs while supporting standard SMT assembly.
• Low-Voltage Core Operation: Core supply range of 0.86 V to 1.15 V allows integration into low-voltage power domains.

Why Choose EP3SE110F1152I3N?

The EP3SE110F1152I3N combines a high logic element count, substantial embedded memory, and a large I/O complement in an industrial-grade FPGA package. This combination supports complex, high-density programmable designs where on-chip resources and robust operating range are important.

It is well suited for engineers and system designers building communications equipment, industrial controllers, imaging systems, and high-channel-count data acquisition solutions who need a scalable, programmable hardware building block with clear, verifiable specifications.

Request a quote or submit an inquiry for pricing and availability of EP3SE110F1152I3N to progress your design evaluation and procurement.