EP3SE110F1152I4L

The EP3SE110F1152I4L is a Stratix® III E FPGA IC offering high logic density and extensive on-chip memory in a compact FCBGA package. Its combination of 107,500 logic elements, approximately 8.9 Mbits of embedded memory, and 744 I/O pins supports complex, high‑channel-count designs.

Designed for industrial applications, this surface‑mount device operates across a –40 °C to 100 °C range and accepts a core supply range of 860 mV to 1.15 V, making it suitable for demanding environments that require robust, reconfigurable logic and significant I/O integration.

Key Features

• Core: 107,500 logic elements Provides substantial programmable logic capacity for complex state machines, datapaths, and custom accelerators.
• Configurable Logic Blocks (CLBs): 4,300 A large CLB count to structure logic resources for parallel and pipelined implementations.
• Embedded memory Approximately 8.9 Mbits of on‑chip RAM to support buffering, look‑up tables, and intermediate data storage without external memory.
• I/O Count: 744 High pin count for broad connectivity to peripherals, sensors, and high‑speed interfaces.
• Voltage supply Core supply range from 860 mV to 1.15 V to match low‑voltage system architectures.
• Package & mounting 1152‑FBGA (35×35) FCBGA package, surface‑mount for dense board integration.
• Industrial temperature range Rated for operation from –40 °C to 100 °C and specified as industrial grade for use in temperature‑sensitive applications.
• RoHS compliant Meets RoHS environmental requirements for lead‑free manufacturing processes.

Typical Applications

• Industrial control and automation — Leverage the device’s industrial temperature rating and high I/O count for sensor interfacing, motor control, and distributed control systems.
• Communications and networking — Use the large logic resource pool and on‑chip memory for packet processing, protocol handling, and custom interface bridging.
• High‑performance signal processing — Implement parallel datapaths and buffering using abundant logic elements and embedded RAM for real‑time processing tasks.
• Custom computing and prototyping — Reconfigurable fabric and dense resources enable rapid iteration of custom accelerators, controllers, and system prototypes.

Unique Advantages

• High logic density: 107,500 logic elements provide headroom for complex designs without immediate partitioning across multiple devices.
• Substantial embedded memory: Approximately 8.9 Mbits of on‑chip RAM reduce dependence on external memory for many buffering and LUT needs.
• Extensive I/O integration: 744 I/O pins simplify board design by enabling direct connections to numerous peripherals and interfaces.
• Industrial readiness: –40 °C to 100 °C operating range and industrial grade classification support deployment in harsh environments.
• Compact, manufacturable package: 1152‑FBGA (35×35) FCBGA surface‑mount package balances density with standard PCB assembly processes.
• Environmental compliance: RoHS compliance supports modern manufacturing and regulatory needs.

Why Choose EP3SE110F1152I4L?

The EP3SE110F1152I4L positions itself as a high‑density, industrial‑grade FPGA solution that combines extensive programmable logic, significant on‑chip memory, and a very high I/O count in a compact FCBGA package. These characteristics make it well suited to system designs that need reconfigurable hardware with robust environmental performance.

Designers targeting industrial automation, communications infrastructure, signal processing, or custom computing platforms will find the device’s resource mix advantageous for consolidating functions, reducing external component count, and enabling future firmware‑level updates to extend product lifecycles.

Request a quote or submit an inquiry to receive pricing and availability details for EP3SE110F1152I4L and to discuss how it can meet your project requirements.