EP3SE110F1152I4LN

The EP3SE110F1152I4LN is a Stratix® III E field programmable gate array (FPGA) delivering high-density programmable logic and substantial embedded memory in a compact FCBGA package. It combines 107,500 logic elements with approximately 8.9 Mbits of on-chip RAM and 744 user I/Os to address applications that require large logic capacity, significant local memory, and extensive connectivity.

Designed for industrial-grade operation, this device supports a core supply range of 860 mV to 1.15 V and an operating temperature range of −40 °C to 100 °C, packaged in a 1152-FBGA (35 × 35) surface-mount form factor for space-constrained system designs.

Key Features

• Core Capacity  Provides 107,500 logic elements to implement complex custom logic, state machines, and control functions.
• Embedded Memory  Approximately 8.9 Mbits of on-chip RAM for local buffering, lookup tables, and data storage without external memory.
• I/O and Connectivity  744 user I/Os to support dense peripheral interfacing, multi-channel data acquisition, and wide bus implementations.
• Power and Voltage  Operates with a core voltage supply range of 860 mV to 1.15 V, enabling integration into designs with modern low-voltage power rails.
• Package & Mounting  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) in a surface-mount format for compact PCB layouts.
• Thermal and Grade  Industrial temperature rating from −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant to meet common environmental and materials requirements.

Typical Applications

• High-density logic and signal processing  Implement complex signal-processing pipelines and custom logic with the large number of logic elements and embedded RAM.
• Memory-intensive embedded systems  Use the approximately 8.9 Mbits of on-chip RAM for buffering, packet queuing, and LUT-heavy algorithms without immediate reliance on external memory.
• I/O-dense control systems  Leverage 744 I/Os for multi-channel sensor interfaces, parallel buses, and extensive peripheral integration.
• Industrial equipment and instrumentation  Industrial-grade temperature range and robust packaging support deployment in industrial controllers and monitoring systems.

Unique Advantages

• Large programmable logic capacity: 107,500 logic elements enable implementation of sophisticated custom logic and feature-rich designs.
• Substantial on-chip memory: Approximately 8.9 Mbits of embedded RAM reduces dependence on external memory and simplifies board-level design.
• High I/O density: 744 user I/Os allow flexible connectivity to multiple peripherals and parallel interfaces.
• Industrial temperature rating: −40 °C to 100 °C supports use in temperature-challenging environments.
• Compact FCBGA packaging: 1152-FBGA (35×35) surface-mount package offers a high-pin-count solution in a compact footprint for space-constrained PCBs.
• RoHS compliant: Meets common environmental compliance expectations for modern electronics manufacturing.

Why Choose EP3SE110F1152I4LN?

The EP3SE110F1152I4LN positions itself as a high-density, industrial-grade Stratix® III E FPGA suitable for designs that require a combination of large logic resources, significant embedded memory, and a high I/O count in a compact FCBGA package. Its voltage range and thermal rating make it compatible with modern low-voltage systems and industrial operating environments.

Choose this device when your design demands substantial on-chip resources and connectivity while maintaining a compact PCB footprint and compliance with RoHS material restrictions. The EP3SE110F1152I4LN is well suited for engineers and procurement teams building robust, scalable systems that leverage programmable logic for customization and performance.

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