EP3SE110F780C2N

The EP3SE110F780C2N is a Stratix® III E field programmable gate array (FPGA) from Intel, delivering large-scale programmable logic and embedded memory in a commercial-grade, surface-mount package. It combines a high logic element count with substantial on-chip RAM and a broad I/O complement for dense, configurable digital designs.

Designed for applications that require significant programmable resources within a single device footprint, this FPGA provides a wide core voltage range and a standard commercial operating temperature range for mainstream electronic systems.

Key Features

• Logic Capacity — 107,500 logic elements to implement complex custom digital functions and control logic.
• Embedded Memory — Approximately 8.94 Mbits of on-chip RAM to support data buffering, lookup tables, and state storage without external memory.
• I/O Density — 488 user I/O pins to interface with high-pin-count peripherals and system buses.
• Power Supply — Core voltage support from 0.860 V to 1.15 V, enabling integration into designs with low-voltage core rails.
• Package and Mounting — 780-BBGA FCBGA package (supplier device package: 780-FBGA 29×29) with surface-mount mounting for PCB assembly.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C for standard consumer and commercial electronics environments.
• Compliance — RoHS compliant, meeting common environmental directive requirements for lead-free assembly.
• Manufacturer — Intel Stratix® III E family device, ensuring consistent manufacturing and identification.

Typical Applications

• High-density programmable logic — Implement large-scale custom digital subsystems that require many logic elements and embedded memory inside one FPGA.
• I/O-intensive systems — Drive complex board-level interfaces and multiple peripherals using the device’s 488 I/O pins.
• Platform prototyping and integration — Use the device to consolidate functions and validate system-level digital designs where on-chip memory and logic density are essential.

Unique Advantages

• Substantial logic resources — 107,500 logic elements reduce the need for multiple devices in logic-heavy designs.
• Significant on-chip memory — Approximately 8.94 Mbits of embedded RAM supports buffering and state machines without immediate reliance on external memory.
• High I/O count — 488 I/Os allow direct connection to numerous peripherals and interfaces, simplifying board routing and system partitioning.
• Standard commercial temperature rating — 0 °C to 85 °C operation fits mainstream consumer and commercial product requirements.
• Compact FCBGA package — 780-ball BGA (29×29) surface-mount package enables dense PCB integration while maintaining high pin count.

Why Choose EP3SE110F780C2N?

The EP3SE110F780C2N positions itself as a high-capacity, commercially graded Stratix® III E FPGA suited to designs that need a combination of large logic resources, substantial embedded memory, and a high number of I/Os. Its core voltage range and FCBGA package make it appropriate for compact, high-density board implementations in consumer and commercial systems.

This device is appropriate for teams and projects that require a single, integrated FPGA solution to consolidate digital functions, reduce board-level complexity, and leverage the known identity of the Intel Stratix® III E product family.

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