EP3SE110F780C3

The EP3SE110F780C3 is a Stratix® III E field programmable gate array supplied in a 780-BBGA FCBGA package. It delivers a large logic fabric with 4,300 LABs and 107,500 logic elements alongside substantial on-chip memory and I/O density.

Key device characteristics include approximately 8.9 Mbits of embedded RAM, 488 user I/Os, a core voltage range of 0.86 V to 1.15 V, and a commercial operating temperature range of 0 °C to 85 °C, making it suitable for complex digital designs that require high logic capacity and memory on a surface-mount BGA package.

Key Features

• Core / Logic  4,300 LABs and 107,500 logic elements provide the primary programmable fabric for implementing large, custom logic functions.
• Memory  Approximately 8.9 Mbits of on-chip RAM for embedded data buffering, state storage, and local memory needs.
• I/O  488 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power  Core supply voltage range from 0.86 V to 1.15 V to match system power-rail requirements.
• Package & Mounting  780-BBGA FCBGA (supplier device package: 780-FBGA, 29×29) in a surface-mount configuration for compact board-level integration.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to meet standard lead-free assembly requirements.

Unique Advantages

• High logic capacity: 107,500 logic elements enable implementation of large, complex digital functions on a single FPGA.
• Substantial embedded memory: Approximately 8.9 Mbits of on-chip RAM reduces reliance on external memory for many designs.
• Extensive I/O connectivity: 488 I/O pins provide options for wide buses, multiple interfaces, and board-level flexibility.
• Compact BGA package: 780-BBGA (29×29) minimizes PCB footprint while supporting high pin count and signal density.
• Controlled core voltage range: 0.86 V to 1.15 V core supply supports integration with common power architectures.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial applications.

Why Choose EP3SE110F780C3?

The EP3SE110F780C3 combines large logic capacity, significant embedded RAM, and high I/O density in a compact 780-BBGA surface-mount package. These attributes make it well suited to complex digital designs that require on-chip memory and extensive connectivity within commercial temperature environments.

Choosing this device provides a balance of integration and board-level density for designers targeting high logic-count implementations while maintaining RoHS compliance and standard commercial-grade operating limits.

Request a quote or submit an inquiry for pricing, lead time, and additional technical details to evaluate the EP3SE110F780C3 for your next design.