EP3SE110F780C3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 726 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4300 | Number of Logic Elements/Cells | 107500 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 8936448 |
Overview of EP3SE110F780C3G – Stratix III Field Programmable Gate Array (FPGA) IC
The EP3SE110F780C3G is an Intel Stratix III family FPGA offering a high-density, programmable logic platform for performance-oriented embedded and DSP designs. It combines 107,500 logic elements with on-chip memory and modular I/O to support complex logic, memory interfaces, and high-speed data tasks.
Designed for commercial-grade applications, this device delivers flexible power options, configurable I/O, and a compact 780-ball FBGA package, making it suitable for systems that require integration of logic, memory, and high-speed interfaces while meeting standard commercial temperature and RoHS requirements.
Key Features
- Logic Capacity 107,500 logic elements provide the programmable fabric needed for complex control, DSP, and embedded logic functions.
- Embedded Memory Approximately 8.94 Mbits of on-chip RAM (8,936,448 total bits) for large buffers, FIFOs, and memory-mapped data structures.
- I/O and Package 488 user I/O pins in a 780-ball FBGA package (supplier package 780-FBGA, 29×29) with surface-mount mounting for compact board integration.
- Power and Core Voltage Core supply range from 860 mV to 1.15 V and support for selectable core voltage options as described for the Stratix III family to balance performance and power.
- Family Architecture and Capabilities Built on the Stratix III architecture, the family provides programmable power technology, selectable core voltage, high-speed DSP blocks, and extensive clocking resources (family-level features).
- Operating Range and Compliance Commercial operating temperature of 0 °C to 85 °C and RoHS compliance for environmental regulation adherence.
- Reliability Features Stratix III family-level features include configuration error detection and optional AES-based configuration security and error-correcting memory blocks (family-level capabilities).
Typical Applications
- High-Performance Logic and Control Implement complex state machines, protocol handling, and system controllers that leverage the device’s large logic capacity and embedded memory.
- Digital Signal Processing (DSP) Use the device for DSP pipelines, filtering, and multiply-accumulate workloads that benefit from Stratix III DSP block support and extensive logic resources.
- Memory Interface and Buffering Integrate memory controllers, large FIFOs, and buffering for external memory interfaces using the on-chip RAM and modular I/O banks.
- Networking and Communication Implement protocol bridges, packet processing, and interface logic that require high I/O density and flexible clocking.
Unique Advantages
- High Logic Density: 107,500 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
- Substantial On-Chip Memory: Approximately 8.94 Mbits of embedded RAM supports large buffers and on-device data storage, minimizing external memory dependencies.
- Flexible Power Options: Core voltage range (860 mV–1.15 V) and Stratix III family programmable power technology help tune performance versus power consumption.
- Compact Surface-Mount Package: 780-FBGA (29×29) ball package provides high I/O count in a space-efficient form factor for dense PCB layouts.
- Commercial Temperature Rating: Rated from 0 °C to 85 °C to match typical commercial electronics deployment requirements.
- Standards-Based Reliability: Family-level features such as configuration error detection and optional AES configuration security add robustness for long-term operation.
Why Choose EP3SE110F780C3G?
The EP3SE110F780C3G delivers a balance of high logic capacity, significant embedded memory, and a dense I/O package suitable for demanding embedded, DSP, and networking applications. Its Stratix III family heritage provides architectural features—such as programmable power options, advanced clocking, and reliability mechanisms—that support scalable system designs and long-term maintainability.
This device is well suited to teams looking to consolidate functions onto a single FPGA, reduce external component count, and leverage family-level capabilities for performance-tunable designs in commercial-temperature systems.
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