EP3SE110F780C2

The EP3SE110F780C2 is a Stratix® III E Field Programmable Gate Array (FPGA) supplied in a 780-ball FCBGA package. It delivers high-density programmable logic and on-chip memory suited for commercial-grade embedded systems requiring substantial logic capacity and I/O connectivity.

With 107,500 logic elements, approximately 8.9 Mbits of embedded memory and 488 I/Os, this device supports complex digital designs while operating from a 0.86 V to 1.15 V supply and within a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  107,500 logic elements provide a high-density fabric for implementing complex digital functions and custom logic blocks.
• Embedded Memory  Approximately 8.9 Mbits of on-chip RAM support data buffering, lookup tables and state storage for high-throughput designs.
• I/O Capacity  488 user I/Os enable broad external connectivity for parallel interfaces, control signals and mixed-signal front ends.
• Power Supply  Operates from a core voltage range of 860 mV to 1.15 V, allowing integration into modern low-voltage power domains.
• Package & Mounting  780-BBGA (FCBGA) surface-mount package, supplier package listed as 780-FBGA (29×29), for compact board-level integration.
• Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliance  Device is RoHS compliant, supporting environmentally conscious manufacturing requirements.

Typical Applications

• High-density digital processing  Implement complex algorithms and custom datapaths using the device’s 107,500 logic elements and embedded memory.
• I/O-intensive systems  Systems requiring extensive external interfacing can leverage the 488 user I/Os for sensors, peripherals and parallel buses.
• Commercial embedded platforms  Designed for commercial-grade products that operate within 0 °C to 85 °C and require RoHS-compliant components.

Unique Advantages

• High logic density: 107,500 logic elements provide the capacity to consolidate multiple functions into a single programmable device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 8.9 Mbits of embedded RAM support data buffering and state retention without external memory.
• Extensive I/O: 488 I/Os enable flexible connectivity options and simplify integration with external peripherals.
• Compact FCBGA package: The 780-BBGA (29×29) surface-mount package helps minimize PCB area while providing robust mounting for high-density designs.
• Commercial temperature and RoHS compliance: Suited to commercial applications and compliant with environmental regulations for streamlined manufacturing.

Why Choose EP3SE110F780C2?

The EP3SE110F780C2 balances high logic capacity and embedded memory with broad I/O capability in a compact FCBGA package, making it a practical choice for commercial embedded designs that need programmable flexibility and significant on-chip resources. Its specified supply voltage range and commercial operating temperature provide clear system-level parameters for power and thermal planning.

This device is well suited to engineers and procurement teams designing mid- to high-complexity digital systems who require a RoHS-compliant, commercially graded FPGA with proven logic and memory resources. Its integration potential helps reduce external components and simplify board-level architecture.

Request a quote or submit a purchase inquiry to learn more about availability, pricing and lead times for the EP3SE110F780C2.