EP3SE110F780C2G

The EP3SE110F780C2G is an Intel Stratix III family FPGA offering a high-density programmable logic fabric for performance-driven digital designs. This device combines 107,500 logic elements with on-chip embedded memory and extensive I/O to address demanding applications in high-performance logic, digital signal processing (DSP), and embedded systems.

Designed with power flexibility and system integration in mind, the Stratix III architecture provides programmable power technology and selectable core voltage while delivering a platform suited to complex memory interfaces, clocking structures, and high-speed I/O requirements.

Key Features

• Logic Capacity — 107,500 logic elements for complex combinational and sequential logic implementation.
• Embedded Memory — Approximately 8.94 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive logic.
• I/O and Packaging — 488 user I/O pins in a 780-ball FCBGA (29×29) package; surface-mount mounting for standard PCB assembly.
• Core Voltage — Selectable core supply range from 0.860 V to 1.15 V to balance performance and power.
• Operating Condition — Commercial-grade device rated for 0 °C to 85 °C operation; RoHS compliant.
• Stratix III Family Capabilities — Family-level features include Programmable Power Technology, optional 256-bit AES configuration security, built-in ECC and CRC for memory and configuration reliability, and dedicated DSP/multiplier resources as documented for Stratix III devices.
• Clocking and PLLs — Stratix III devices provide extensive clocking resources and multiple PLLs for flexible clock synthesis and management (family-level specification).
• High-speed I/O Support — Family-level support for modular I/O banks, dynamic on-chip termination, and high-speed differential SERDES interfaces (family-level specification).

Typical Applications

• High-performance signal processing — Implement DSP pipelines, FIR filters, and multiplier-accumulate operations using the Stratix III family’s dedicated DSP resources.
• Networking and communications — Use the device’s high-speed I/O and SERDES family capabilities for protocol bridging, packet processing, and line-rate interfaces.
• Memory interface controllers — Deploy controllers for DDR/DDR2/DDR3 and other high-speed external memories leveraging on-package I/O and DQS support described for the family.
• Embedded systems and prototyping — Integrate custom processors, peripheral logic, and memory subsystems—Stratix III family devices support embedded processor IP and a broad IP ecosystem.

Unique Advantages

• High integration: 107,500 logic elements combined with nearly 9 Mbits of embedded RAM reduce external component needs and simplify board-level design.
• Flexible power-performance trade-offs: Selectable core voltage and programmable power features enable designers to tune for lower power or higher performance.
• Extensive I/O capacity: 488 user I/O and a 780-ball FCBGA package provide ample connectivity for complex interfaces and dense board routing.
• Built-in reliability features: Family-level error detection and correction (ECC), CRC configuration checks, and optional AES configuration security support robust system operation.
• Scalable clocking and timing resources: Multiple clock networks and PLL capability (per family specification) let designers manage multi-domain timing and clock synthesis.

Why Choose EP3SE110F780C2G?

The EP3SE110F780C2G positions itself as a high-density, flexible FPGA solution for designers requiring significant logic capacity, embedded memory, and broad I/O in a commercial-grade package. Its alignment with the Stratix III family architecture brings power-management features, security options, and DSP-oriented resources suited to performance-sensitive applications.

This device is appropriate for teams building advanced communication interfaces, memory controllers, DSP assemblies, or embedded prototypes that benefit from a mature FPGA architecture and family-level IP support.

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