EP3SE110F1152I4N

The EP3SE110F1152I4N is a Stratix® III E field programmable gate array (FPGA) IC designed for high‑density digital designs. It combines a large logic fabric with substantial on‑chip memory and a high I/O count to support complex system integration.

With 107,500 logic elements, approximately 8.94 Mbits of embedded memory and 744 user I/Os in a 1152‑BBGA (35×35) surface‑mount package, this device targets designs that require significant integration, robust I/O connectivity and operation across an industrial temperature range.

Key Features

• Core Logic 107,500 logic elements provide capacity for complex combinational and sequential logic implementations.
• Embedded Memory Approximately 8.94 Mbits of on‑chip RAM (8,936,448 bits) for data buffering, state storage and on‑chip data structures.
• I/O Density 744 user I/Os support extensive device interfacing and high pin‑count system requirements.
• Power Supply Operates with core supply requirements from 860 mV to 1.15 V, enabling integration with a range of power architectures.
• Package & Mounting 1152‑BBGA, FCBGA (supplier device package: 1152‑FBGA, 35×35) in a surface‑mount form factor for compact board layouts.
• Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Environmental Compliance RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• High‑density FPGA systems — Use the device where large logic capacity and on‑chip RAM are needed to implement complex custom logic and processing pipelines.
• Platform integration — High I/O count enables consolidation of multiple functions and interfaces into a single FPGA solution.
• Industrial control and automation — Industrial temperature rating and surface‑mount packaging suit embedded controllers and automation modules.
• Communication and data handling — On‑chip memory and logic resources support data buffering, protocol handling and custom packet processing.

Unique Advantages

• High logic capacity: 107,500 logic elements allow implementation of large, complex designs without immediate need for external logic expansion.
• Substantial on‑chip RAM: Approximately 8.94 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O resources: 744 I/Os enable direct interfacing to multiple peripherals, sensors and external devices, simplifying board-level design.
• Industrial temperature capability: Rated from −40 °C to 100 °C for reliable operation in demanding environmental conditions.
• Compact FCBGA packaging: 1152‑BBGA (35×35) surface‑mount package supports high density PCB layouts while maintaining manufacturability.
• Regulatory readiness: RoHS compliance supports environmentally conscious product development and deployment.

Why Choose EP3SE110F1152I4N?

The EP3SE110F1152I4N offers a balance of high logic capacity, significant on‑chip memory and a large I/O complement in a compact FCBGA package, making it a strong candidate for designs that demand integration and scalability. Its industrial temperature rating and RoHS compliance provide practical reliability for deployed systems.

This device is suited for engineering teams developing complex FPGA‑based solutions where board space, I/O count and embedded memory are key design drivers. The combination of resources supports evolving designs that need both immediate capability and headroom for future feature additions.

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