EP3SE110F1152I4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,295 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 744 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4300 | Number of Logic Elements/Cells | 107500 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 8936448 |
Overview of EP3SE110F1152I4G – Field Programmable Gate Array (FPGA) IC
The EP3SE110F1152I4G is an Intel Stratix III family FPGA offering high logic density and on-chip memory for demanding digital designs. Built on a 65-nm process, this device targets high-performance logic, DSP and embedded system applications that require substantial programmable resources, flexible I/O and industrial operating range.
With 107,500 logic elements, approximately 8.94 Mbits of embedded memory, and 744 user I/O, the device delivers a balance of compute resources, memory bandwidth and interface capacity for networking, signal processing and custom accelerator use cases.
Key Features
- Core Logic — 107,500 logic elements provide substantial programmable logic capacity for complex state machines, custom datapaths and control logic.
- Embedded Memory — Approximately 8.94 Mbits of on-chip RAM to implement FIFOs, buffers and local data storage without external memory bandwidth.
- I/O and Interfaces — 744 user I/O pins in a modular I/O structure enable dense connectivity to peripherals, memory devices and high-speed links.
- High‑Speed DSP and Clocking — Stratix III family DSP resources and multiple PLLs support high-performance multiply-accumulate and timing architectures for DSP and data-centric applications.
- Power Options — Selectable core voltage with a supply range of 860 mV to 1.15 V supports trade-offs between performance and power consumption.
- Package & Mounting — 1152-ball FCBGA (1152-FBGA, 35×35) package, surface-mount mounting for compact board integration.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial environments.
- Security and Reliability — Stratix III family features include optional 256‑bit AES configuration encryption, CRC for configuration memory, and ECC protection for embedded memory blocks to improve system robustness.
Typical Applications
- High‑Performance DSP and Signal Processing — Large logic fabric and family DSP blocks enable implementation of real-time filters, FFTs and custom accelerators for communications and instrumentation.
- Networking and Communications — High pin count and Stratix III high-speed I/O support make the device suitable for interface bridging, packet processing and protocol offload tasks.
- Memory Interface and Controllers — Substantial on-chip memory and timing resources support memory controller logic and buffering for external SDRAM/DDR interfaces.
- Embedded Systems and Custom SoC — Use as a platform for custom peripherals, hardware accelerators and soft-core processors to consolidate system functions on a single FPGA.
Unique Advantages
- Highly integrated logic capacity: 107,500 logic elements reduce the need for multiple devices and simplify partitioning of large designs.
- Substantial on‑chip memory: Approximately 8.94 Mbits of embedded RAM enables local buffering and low-latency data paths without immediate dependence on external memory.
- Flexible, high‑density I/O: 744 user I/O pins provide the connectivity required for multi-channel interfaces, wide memory buses and multi-protocol designs.
- Configurable power-performance trade-offs: Selectable core voltage (860 mV to 1.15 V) supports tuning for power-sensitive or performance-critical modes.
- Industrial robustness: Surface-mount 1152-FBGA packaging and −40 °C to 100 °C rating accommodate demanding operating environments.
- Configuration security and memory protection: Family-level AES encryption options plus CRC and ECC improve design protection and run-time reliability.
Why Choose EP3SE110F1152I4G?
The EP3SE110F1152I4G combines a large logic fabric, multi-megabit on-chip memory and a high I/O count in a compact 1152-ball FBGA package to address complex digital, DSP and embedded workloads. Its selectable core voltage and family-level power management features let designers balance performance and power for their target application.
This device is well suited for engineers and system designers seeking a programmable platform with ample resources for networking, signal processing, memory interfacing and custom hardware acceleration, backed by the Stratix III family feature set for security and reliability.
Request a quote or submit a purchase inquiry to get pricing and availability information for EP3SE110F1152I4G. Our team can provide lead-time details and help match the part to your design requirements.

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