EP3SE110F1152I4G

IC FPGA 744 I/O 1152FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,295 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4300Number of Logic Elements/Cells107500
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits8936448

Overview of EP3SE110F1152I4G – Field Programmable Gate Array (FPGA) IC

The EP3SE110F1152I4G is an Intel Stratix III family FPGA offering high logic density and on-chip memory for demanding digital designs. Built on a 65-nm process, this device targets high-performance logic, DSP and embedded system applications that require substantial programmable resources, flexible I/O and industrial operating range.

With 107,500 logic elements, approximately 8.94 Mbits of embedded memory, and 744 user I/O, the device delivers a balance of compute resources, memory bandwidth and interface capacity for networking, signal processing and custom accelerator use cases.

Key Features

  • Core Logic — 107,500 logic elements provide substantial programmable logic capacity for complex state machines, custom datapaths and control logic.
  • Embedded Memory — Approximately 8.94 Mbits of on-chip RAM to implement FIFOs, buffers and local data storage without external memory bandwidth.
  • I/O and Interfaces — 744 user I/O pins in a modular I/O structure enable dense connectivity to peripherals, memory devices and high-speed links.
  • High‑Speed DSP and Clocking — Stratix III family DSP resources and multiple PLLs support high-performance multiply-accumulate and timing architectures for DSP and data-centric applications.
  • Power Options — Selectable core voltage with a supply range of 860 mV to 1.15 V supports trade-offs between performance and power consumption.
  • Package & Mounting — 1152-ball FCBGA (1152-FBGA, 35×35) package, surface-mount mounting for compact board integration.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial environments.
  • Security and Reliability — Stratix III family features include optional 256‑bit AES configuration encryption, CRC for configuration memory, and ECC protection for embedded memory blocks to improve system robustness.

Typical Applications

  • High‑Performance DSP and Signal Processing — Large logic fabric and family DSP blocks enable implementation of real-time filters, FFTs and custom accelerators for communications and instrumentation.
  • Networking and Communications — High pin count and Stratix III high-speed I/O support make the device suitable for interface bridging, packet processing and protocol offload tasks.
  • Memory Interface and Controllers — Substantial on-chip memory and timing resources support memory controller logic and buffering for external SDRAM/DDR interfaces.
  • Embedded Systems and Custom SoC — Use as a platform for custom peripherals, hardware accelerators and soft-core processors to consolidate system functions on a single FPGA.

Unique Advantages

  • Highly integrated logic capacity: 107,500 logic elements reduce the need for multiple devices and simplify partitioning of large designs.
  • Substantial on‑chip memory: Approximately 8.94 Mbits of embedded RAM enables local buffering and low-latency data paths without immediate dependence on external memory.
  • Flexible, high‑density I/O: 744 user I/O pins provide the connectivity required for multi-channel interfaces, wide memory buses and multi-protocol designs.
  • Configurable power-performance trade-offs: Selectable core voltage (860 mV to 1.15 V) supports tuning for power-sensitive or performance-critical modes.
  • Industrial robustness: Surface-mount 1152-FBGA packaging and −40 °C to 100 °C rating accommodate demanding operating environments.
  • Configuration security and memory protection: Family-level AES encryption options plus CRC and ECC improve design protection and run-time reliability.

Why Choose EP3SE110F1152I4G?

The EP3SE110F1152I4G combines a large logic fabric, multi-megabit on-chip memory and a high I/O count in a compact 1152-ball FBGA package to address complex digital, DSP and embedded workloads. Its selectable core voltage and family-level power management features let designers balance performance and power for their target application.

This device is well suited for engineers and system designers seeking a programmable platform with ample resources for networking, signal processing, memory interfacing and custom hardware acceleration, backed by the Stratix III family feature set for security and reliability.

Request a quote or submit a purchase inquiry to get pricing and availability information for EP3SE110F1152I4G. Our team can provide lead-time details and help match the part to your design requirements.

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