EP3SE110F1152C4N

The EP3SE110F1152C4N is a Stratix® III E Field Programmable Gate Array (FPGA) from Intel, delivering high-density programmable logic and on-chip memory in a compact FCBGA package. It targets designs that require a large number of logic elements, substantial embedded RAM, and high I/O counts while operating within commercial temperature and low-voltage core ranges.

Key Features

• Core Logic  107,500 logic elements provide substantial resources for complex digital implementations and logic-intensive functions.
• Embedded Memory  Approximately 8.94 Mbits of on-chip RAM (8,936,448 bits) to support buffering, packet processing, and algorithmic data storage without large external memory.
• I/O Capacity  744 device I/Os for broad external connectivity, supporting multi-channel interfaces and high-pin-count board designs.
• Power  Core voltage supply range of 0.86 V to 1.15 V to match low-voltage system requirements.
• Package & Mounting  1152-BBGA FCBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for compact board integration.
• Operating Conditions  Commercial-grade temperature range of 0°C to 85°C and RoHS compliance for standard commercial product environments.

Typical Applications

• High-density digital processing  Systems that require many programmable logic resources and on-chip RAM for parallel processing and datapath implementations.
• Multi-channel interface aggregation  Designs needing a large number of I/Os to connect multiple peripherals, sensors, or communication lanes.
• Embedded memory–intensive functions  Applications that benefit from approximately 8.94 Mbits of embedded RAM for buffering, queues, or temporary storage without relying solely on off-chip memory.

Unique Advantages

• High logic density: 107,500 logic elements enable consolidation of complex logic and state machines into a single device, reducing system-level component count.
• Substantial on-chip RAM: Approximately 8.94 Mbits of embedded memory minimizes external memory needs for many buffering and storage tasks.
• Large I/O complement: 744 I/Os provide flexibility for designs with numerous interfaces or parallel data paths.
• Compact surface-mount package: The 1152-FBGA (35×35) FCBGA package allows for dense board layouts while maintaining high pin count.
• Low-voltage core compatibility: Operates from 0.86 V to 1.15 V, supporting integration with low-voltage system rails.
• Commercial-grade and RoHS compliant: Specified for 0°C to 85°C operation and compliant with RoHS requirements for standard commercial deployments.

Why Choose EP3SE110F1152C4N?

The EP3SE110F1152C4N delivers a high-capacity FPGA option for designs that require a large pool of logic resources, significant embedded memory, and extensive I/O. Its low-voltage core range and compact 1152-FBGA surface-mount package make it suitable for space-conscious, logic-dense commercial applications operating within 0°C to 85°C.

Choose this Stratix® III E device when your project demands consolidated logic, on-chip RAM for data handling, and a high number of external connections—providing a single-device solution that simplifies board-level integration and reduces component count.

Request a quote or submit an RFQ today to receive pricing and availability for the EP3SE110F1152C4N.