EP3SE110F1152I3

The EP3SE110F1152I3 is a Stratix® III E field programmable gate array (FPGA) device supplied in a 1152-BBGA FCBGA package. It provides a high logic element count and substantial on-chip memory for dense digital designs in industrial-grade applications.

With a wide I/O complement and a low-voltage core supply range, this device targets designs that require large-scale logic integration, significant embedded memory, and robust operation across an extended temperature range.

Key Features

• Logic Capacity — 107,500 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory — Approximately 8.94 Mbits of on-chip RAM for buffering, state storage, and intermediate data processing.
• General-Purpose I/O — 744 available I/O pins to support wide bus interfaces and high-density external connectivity.
• Power — Core supply range of 0.86 V to 1.15 V to match low-voltage system designs.
• Package and Mounting — 1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount FCBGA form factor for compact board layouts.
• Temperature Range — Industrial operating range from −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance — RoHS compliant to meet standard material restrictions.

Typical Applications

• Industrial Automation — Implement real-time control logic and interface dense sensor/actuator networks using the device’s high logic and I/O resources.
• Communications Equipment — Support complex protocol handling and on-chip buffering with ample logic and embedded memory.
• High-Density Data Interfacing — Consolidate multiple parallel bus interfaces and custom glue logic in a single FPGA to simplify board-level design.

Unique Advantages

• High Logic Density: 107,500 logic elements enable large-scale integration of custom digital functions and state machines.
• Substantial On-Chip Memory: Approximately 8.94 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O Count: 744 I/Os provide the flexibility to connect numerous peripherals and parallel interfaces directly to the FPGA.
• Industrial Temperature Capability: Rated for −40 °C to 100 °C operation to support deployment in harsher environments.
• Compact Surface-Mount Package: 1152-BBGA (35×35) FCBGA allows high-density board designs while maintaining strong signal routing density.
• Low-Voltage Core: 0.86–1.15 V core supply range suitable for low-power digital cores and compatible system power architectures.

Why Choose EP3SE110F1152I3?

The EP3SE110F1152I3 combines a high count of logic elements, significant embedded memory, and an extensive I/O complement in an industrial-grade FPGA package. It is well suited for designers who need to consolidate complex digital functions, high-density interfaces, and on-chip buffering into a single surface-mount device.

For projects requiring scalable logic resources, robust thermal performance, and RoHS-compliant materials, this Stratix® III E FPGA provides a reliable platform that aligns with demanding system requirements while supporting compact PCB implementations.

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