EP3SE110F1152C4LG

The EP3SE110F1152C4LG is an Intel Stratix® III family FPGA device optimized for high-performance, programmable logic and DSP-intensive designs. Built on a 65‑nm process with programmable power features, this surface-mount FCBGA device delivers high logic density, substantial embedded memory, and a broad I/O complement for communications, high-speed processing, and advanced system integration.

This commercial-grade FPGA suits applications that require a balance of compute resources, on-chip memory, and flexible I/O while operating within a 0 °C to 85 °C ambient range and a core supply window of 0.86 V to 1.15 V.

Key Features

• Core Logic — Provides 107,500 logic elements for implementing complex FPGA designs and custom accelerators.
• Embedded Memory — Approximately 8.94 Mbits of on-chip RAM to support FIFOs, buffering, and embedded data structures.
• I/O and Interfaces — 744 user I/O pins for flexible interfacing; family-level support includes modular I/O banks and high-speed differential interfaces (series documentation).
• Clocking and DSP — Family-level support for multiple global and regional clocks and up to 12 PLLs for clock synthesis and dynamic phase control (refer to series documentation for details).
• Power and Voltage — Selectable operation across a core voltage supply range of 0.86 V to 1.15 V to balance performance and power.
• Package and Mounting — 1152-ball FCBGA package (1152-FBGA, 35×35 mm) designed for surface-mount PCB assembly.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Compliance — RoHS compliant.

Typical Applications

• High-performance Networking — Use the device to implement packet processing, protocol bridging, and custom networking accelerators that require high logic density and flexible I/O.
• Signal Processing and DSP — Suitable for digital signal processing tasks such as filtering and MAC operations leveraging the family’s DSP capabilities and abundant logic resources.
• Memory Interface Controllers — Implement controllers and interfaces for external memory and buffering, taking advantage of on-chip RAM and modular I/O banks.
• Custom Logic and Prototyping — Ideal for prototyping ASIC functionality or building application-specific accelerators where reprogrammability and logic density are required.

Unique Advantages

• High Logic Density: 107,500 logic elements enable large-scale logic integration on a single device, reducing external glue logic.
• Substantial On-Chip Memory: Approximately 8.94 Mbits of embedded RAM supports deep buffering and data-path implementations without immediate external memory dependence.
• Generous I/O Count: 744 user I/Os provide design flexibility for wide parallel buses, multi-protocol interfaces, and board-level partitioning.
• Flexible Power Envelope: Core supply range from 0.86 V to 1.15 V allows designers to trade off performance and power to match system needs.
• Production-Ready Packaging: 1152-ball FCBGA (35×35) package offers a compact, surface-mount form factor suitable for dense PCBs.
• Regulatory Compliance: RoHS compliance simplifies environmental and manufacturing considerations.

Why Choose EP3SE110F1152C4LG?

The EP3SE110F1152C4LG positions itself as a high-density Stratix III FPGA option for designers who need significant logic resources, on-chip memory, and a broad I/O set in a commercial-temperature device. Its supply voltage flexibility and family-level clocking and DSP capabilities make it suitable for demanding communications, signal-processing, and custom-logic applications.

For teams seeking a scalable, programmable platform with established family features and a compact FCBGA package, this device provides a balanced combination of performance, integration, and production-ready packaging backed by the Stratix III device documentation.

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