EP3SE110F1152C4G

The EP3SE110F1152C4G is an Intel Stratix III family FPGA offering high logic density and on-chip memory in a 1152-ball FBGA package for commercial applications. It targets high-performance logic, DSP and embedded designs that require large programmable fabric, substantial embedded RAM, and extensive I/O capability.

Built on the Stratix III architecture, this device combines a large number of logic elements with dedicated memory and DSP resources, selectable core voltage and programmable power features to balance performance and power for system-level integration.

Key Features

• Logic Capacity — 107,500 logic elements to implement complex custom logic and control functions.
• Embedded Memory — Approximately 8.94 Mbits of on-chip RAM for buffering, FIFOs and memory-intensive functions.
• I/O Resources — 744 user I/O pins to support broad interfacing needs across multiple banks and signaling standards.
• Package & Mounting — 1152-FBGA (35×35) package, surface-mount assembly for compact board-level integration.
• Core Voltage Range — Configurable supply from 0.860 V to 1.15 V to accommodate selectable core voltage operation.
• Operating Range — Commercial temperature grade with specified operation from 0 °C to 85 °C.
• Stratix III Family Capabilities — Architecture-level features including Programmable Power Technology, support for multiple PLLs and a rich clocking structure, high-speed SERDES and memory-interface support as described in the Stratix III device handbook.
• Security & Reliability — Family-level support includes AES encryption options and configuration memory error detection and correction mechanisms.
• RoHS Compliant — Meets RoHS requirements for lead-free assembly and regulatory compliance.

Typical Applications

• High-performance DSP and signal processing — Large logic capacity and embedded memory make the device suited to implement multistage DSP pipelines and FIR filters.
• Networking and communications — Extensive I/O and Stratix III family high-speed SERDES and memory-interface support for packet processing, protocol bridging and interface adaptation.
• Memory controller and interface logic — On-chip RAM and dedicated I/O features support custom DDR/SDRAM interface logic and buffering.
• Embedded system integration — Dense logic and clocking resources enable system control, hardware acceleration and integration of soft processors or custom peripherals.

Unique Advantages

• High logic density: 107,500 logic elements enable integration of large functions on a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 8.94 Mbits of RAM supports deep buffering and on-chip data structures, minimizing external memory dependency.
• Extensive I/O: 744 user I/Os provide flexibility to connect to multiple peripherals, buses and high-pin-count interfaces without external multiplexing.
• Configurable power/performance: Selectable core voltage and Programmable Power Technology let designers trade off performance and power at the device level.
• Robust system features: Family-level support for multiple PLLs, SERDES, dynamic on-chip termination and configuration security improves integration and reliability for complex systems.
• Compact system footprint: 1152-FBGA package and surface-mount construction simplify PCB layout for dense, space-constrained applications.

Why Choose EP3SE110F1152C4G?

The EP3SE110F1152C4G provides a balance of raw logic capacity, embedded memory and flexible I/O in a commercial-grade Stratix III FPGA package. It is well suited to engineers building high-performance DSP engines, complex interface bridges, memory-intense controllers and advanced embedded systems that require on-device resources and configurable power management.

Backed by the Stratix III family architecture and platform-level features—such as programmable power, advanced clocking and security options—this device supports scalable designs and long-term maintainability in production environments.

Request a quote or submit an inquiry to obtain pricing, availability and additional technical support for volume designs and integration planning.