EP3SE110F1152C4L

The EP3SE110F1152C4L is a Stratix® III E Field Programmable Gate Array (FPGA) IC from Intel designed for high-density programmable logic implementations. It combines a large logic fabric with substantial on-chip memory and a wide complement of I/O to support complex digital designs.

With 107,500 logic elements, approximately 8.9 Mbits of embedded memory and 744 I/O pins in a 1152-FBGA (35×35) package, this device targets designs that require significant logic resources, extensive interfacing and compact surface-mount packaging.

Key Features

• Logic Capacity  107,500 logic elements provide substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 8.9 Mbits of on-chip RAM to support buffering, data storage and algorithm implementation without external memory.
• I/O Count  744 I/O pins enable extensive peripheral and bus interfacing within a single device.
• Power Supply  Operates with core supply voltage range from 0.860 V to 1.150 V to match board power architectures.
• Package & Mounting  1152-BBGA, FCBGA (supplier device package: 1152-FBGA 35×35) in a surface-mount form factor for high-density PCB layouts.
• Commercial Temperature Grade  Qualified for 0 °C to 85 °C operation for standard commercial environments.
• RoHS Compliance  Device is RoHS compliant to meet environmental control requirements.

Typical Applications

• Programmable logic and prototyping  Use the device where substantial logic capacity and on-chip memory accelerate design prototyping and validation.
• High‑pin-count interface hubs  With 744 I/Os, integrate multiple interfaces and bridge subsystems on a single FPGA to reduce board complexity.
• On-chip buffering and data handling  Leverage approximately 8.9 Mbits of embedded RAM for packet buffering, FIFO storage and intermediate data processing.

Unique Advantages

• High logic density: 107,500 logic elements enable consolidation of complex logic and multiple functions into one device.
• Generous embedded memory: Approximately 8.9 Mbits of on-chip RAM reduces dependence on external memory and simplifies BOM.
• Extensive I/O resources: 744 I/Os facilitate broad connectivity for multi-interface systems without multiple FPGAs.
• Compact surface-mount packaging: 1152-FBGA (35×35) package allows high integration in space-constrained PCB designs.
• Designed for commercial applications: Rated for 0 °C to 85 °C operation to meet standard commercial environmental requirements.
• RoHS compliant: Supports environmental and regulatory requirements for modern electronics manufacturing.

Why Choose EP3SE110F1152C4L?

The EP3SE110F1152C4L positions itself as a high-density FPGA option for designers who need a large number of logic elements, abundant on-chip memory and extensive I/O in a single surface-mount package. Its combination of 107,500 logic elements, approximately 8.9 Mbits of embedded RAM and 744 I/Os supports consolidation of multi-function designs and reduces reliance on additional components.

This device is well suited for development teams and product designs aiming to integrate complex digital functions within a compact, commercial-grade FPGA platform while maintaining RoHS compliance and a standard commercial operating temperature range.

Request a quote or submit a purchase inquiry today to evaluate EP3SE110F1152C4L for your next high-density programmable logic design.