EP3SE110F1152I4

The EP3SE110F1152I4 is a Stratix® III E field programmable gate array (FPGA) IC designed for applications requiring substantial programmable logic capacity and on-chip memory. It offers a large logic fabric, abundant I/O, and a compact FCBGA package optimized for surface-mount assembly.

With 107,500 logic elements, approximately 8.9 Mbits of embedded memory, and 744 user I/Os, this device targets industrial designs that need configurable digital logic, extensive local memory, and robust operating-range support.

Key Features

• Core Logic — 107,500 logic elements provide significant programmable logic capacity for complex digital functions and custom datapaths.
• Embedded Memory — Approximately 8.9 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for accelerator and signal-processing tasks.
• High I/O Count — 744 user I/Os to interface with wide parallel buses, multi-channel sensors, or multiple peripheral devices.
• Power Supply — Core supply range from 0.86 V to 1.15 V for compatibility with low-voltage system designs.
• Package and Mounting — Supplied in a 1152-BBGA / 1152-FBGA (35×35) FCBGA package for surface-mount PCB assembly and compact system integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Regulatory Compliance — RoHS-compliant material designation for reduced hazardous substance content.

Typical Applications

• Industrial Control — Reconfigurable logic and the −40 °C to 100 °C operating range enable implementation of control algorithms, real-time sequencing, and custom I/O handling in industrial systems.
• Data Processing and Acceleration — Large logic count and embedded RAM support custom datapath acceleration, buffering, and packet processing functions.
• High‑Density I/O Systems — 744 I/Os facilitate wide parallel interfaces, multi-channel acquisition, and complex peripheral aggregation in compact boards.

Unique Advantages

• Substantial Logic Resources: 107,500 logic elements enable complex, highly integrated designs without external programmable devices.
• On‑Chip Memory Capacity: Approximately 8.9 Mbits of embedded RAM reduces dependency on external memory for latency‑sensitive buffering and local data storage.
• Large I/O Count: 744 user I/Os simplify board-level routing for multi-channel systems and enable flexible interfacing options.
• Industrial‑Grade Operation: Rated for −40 °C to 100 °C, suitable for applications requiring extended temperature resilience.
• Compact Surface‑Mount Package: 1152-FBGA (35×35) FCBGA package provides a high density solution for space-constrained PCBs.
• RoHS Compliant: Meets RoHS material requirements for regulatory compatibility in many product designs.

Why Choose EP3SE110F1152I4?

The EP3SE110F1152I4 combines a large programmable logic fabric, substantial on-chip RAM, and a very high I/O count in a compact FCBGA package, making it well suited to industrial applications that require configurable, high-density digital logic. Its extended operating temperature range and surface-mount package support reliable deployment in demanding environments and compact system designs.

For design teams seeking a field‑programmable solution with sizable logic and memory resources from a recognized manufacturer, the EP3SE110F1152I4 offers a clear platform for developing scalable, reconfigurable systems while conforming to RoHS material standards.

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