EP3SE110F1152I4LG

The EP3SE110F1152I4LG is an industrial-grade Stratix III family FPGA optimized for high‑performance logic, digital signal processing (DSP), and embedded system integration. It combines a high logic density, significant embedded RAM, and extensive I/O to address demanding designs that require programmable, reconfigurable silicon.

Built for surface-mount system integration, this device supports a selectable core voltage range and low-power design techniques at the family level, enabling designers to balance performance and power for targeted applications.

Key Features

• Logic Capacity — 107,500 logic elements suitable for complex combinational and sequential logic implementations.
• Embedded Memory — Approximately 8.9 Mbits of on-chip RAM (8,936,448 total RAM bits) for large FIFOs, buffers, and memory-mapped structures.
• I/O and Interfaces — 744 user I/O pins to support wide external connectivity and parallel interfaces in high-density systems.
• Package and Mounting — 1152-BBGA (1152-FBGA, 35×35) package, surface-mount mounting type for board-level assembly.
• Power and Voltage — Device core voltage supply range from 860 mV to 1.15 V; family-level Programmable Power Technology and selectable core voltage support enable power/performance trade-offs.
• Temperature and Grade — Industrial grade with operating range from –40 °C to 100 °C for use in industrial environments.
• Security and Reliability (Family Features) — Stratix III family offers optional 256-bit AES configuration encryption, CRC for configuration memory error detection, and built-in ECC for on-chip memory blocks to support robust operation.
• Clocking and Timing (Family Features) — Family supports multiple global, regional, and peripheral clocks plus up to 12 PLLs for flexible clocking and timing architectures.

Typical Applications

• High-Performance DSP and Signal Processing — Implement DSP pipelines, filters, and multiply-accumulate structures using the device’s logic density and on-chip memory.
• Embedded System Acceleration — Offload compute-intensive tasks and custom logic functions in embedded platforms that require reprogrammable hardware.
• High‑Throughput Interfaces — Support wide parallel and high-speed interfaces with 744 user I/O pins and flexible I/O bank structures.
• Industrial Control and Automation — Use industrial-grade temperature range and surface-mount form factor for rugged control systems and industrial instrumentation.

Unique Advantages

• High Logic Density: 107,500 logic elements deliver the capacity needed for complex custom logic and state-machine designs.
• Substantial On-Chip Memory: Approximately 8.9 Mbits of embedded RAM reduces external memory dependence for many buffering and storage needs.
• Extensive I/O Count: 744 user I/O pins enable broad connectivity options for parallel buses, custom protocols, and multiple peripheral interfaces.
• Industrial Temperature Range: Rated for –40 °C to 100 °C to meet requirements in industrial and other temperature-challenged environments.
• Flexible Power Configuration: Core voltage range of 860 mV to 1.15 V along with family-level programmable power features allow designers to optimize power vs. performance.
• Built‑in Security and Reliability: Family features such as optional 256‑bit AES configuration security, CRC configuration checks, and ECC-protected memory help protect design IP and data integrity.

Why Choose EP3SE110F1152I4LG?

The EP3SE110F1152I4LG positions itself as a capable Stratix III family FPGA option for engineers who need a combination of high logic count, significant embedded memory, and broad I/O in an industrial-grade, surface-mount package. Its voltage range and family-level programmable power technologies help teams tune designs for specific performance and power targets.

This device is well suited to system designers working on DSP-heavy processing, embedded acceleration, and industrial control systems that require reprogrammable logic with integrated reliability and configuration security features. The Stratix III family-level capabilities — including configurable clocking resources, PLLs, and on-chip memory protection — support scalable designs and long-term product flexibility.

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