EP3SE110F780C4

The EP3SE110F780C4 is a Stratix® III E Field Programmable Gate Array (FPGA) in a 780-FBGA (29×29) FCBGA package designed for commercial electronic designs. It combines high logic density, substantial on-chip RAM, and a large I/O count to support complex digital functions and system integration.

Key Features

• Logic Capacity — 107,500 logic elements across 4,300 LABs, enabling implementation of sizeable custom logic and state machines.
• Embedded Memory — Approximately 8.94 Mbits of total on-chip RAM to store buffers, FIFOs, and working data for high-throughput designs.
• I/O Density — 488 I/O pins to support multi-channel interfaces and high-pin-count system connections.
• Power — Core voltage supply range of 0.86 V to 1.15 V to match platform power architectures.
• Package — 780-BBGA, FCBGA package (supplier device package: 780-FBGA (29×29)) for compact board-level integration.
• Mounting & Grade — Surface-mount device rated for commercial use with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Use the FPGA’s high logic element count and on-chip RAM to implement custom digital subsystems in commercial electronic equipment.
• Multi‑I/O Interface Hubs — Leverage 488 I/Os to aggregate and bridge multiple parallel and serial interfaces on a single device.
• Data Buffering and Processing — The sizable embedded memory makes the device suitable for buffering and intermediate data processing tasks in signal and data-path designs.

Unique Advantages

• High integration density: 107,500 logic elements reduce the need for multiple discrete ICs, simplifying board design and minimizing BOM complexity.
• Substantial on‑chip memory: Approximately 8.94 Mbits of RAM supports large buffers and state storage without external memory.
• Extensive I/O count: 488 I/Os provide flexibility for multi-channel connectivity and complex system interconnects.
• Compact FCBGA package: The 780-FBGA (29×29) package enables a space-efficient implementation for high-density boards.
• Commercial temperature rating: Rated 0 °C to 85 °C for a wide range of commercial deployment scenarios.
• RoHS compliant: Meets environmental compliance requirements for lead-free assembly processes.

Why Choose EP3SE110F780C4?

The EP3SE110F780C4 positions itself for designers who need a commercially rated FPGA with high logic density, substantial embedded RAM, and a large I/O complement in a compact FCBGA package. Its combination of 107,500 logic elements, approximately 8.94 Mbits of on-chip memory, and 488 I/Os addresses complex integration tasks while fitting within standard commercial temperature and power envelopes.

For development and production environments that prioritize integration and board-area efficiency, this Stratix® III E device delivers a balance of capacity and package-level convenience that supports scalable designs and streamlined BOMs.

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