EP3SE110F780C4LG

IC FPGA 488 I/O 780FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 604 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4300Number of Logic Elements/Cells107500
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits8936448

Overview of EP3SE110F780C4LG – Field Programmable Gate Array (FPGA) IC

The EP3SE110F780C4LG is a Stratix III family FPGA offering high logic capacity and on-chip memory in a 780-ball FCBGA package. It is intended for high-performance logic, digital signal processing (DSP), and embedded applications that require substantial programmable resources, flexible I/O, and selectable core-voltage operation.

With 107,500 logic elements, approximately 8.94 Mbits of embedded memory, and 488 user I/Os, this surface-mount device targets designs that demand dense logic integration, significant on-chip storage, and commercial-grade operating conditions.

Key Features

  • Logic Capacity — 107,500 logic elements to implement complex programmable logic and state machines.
  • Embedded Memory — Total on-chip RAM of 8,936,448 bits (approximately 8.94 Mbits) for wide FIFOs, buffers, and memory-mapped logic.
  • I/O and Packaging — 488 user I/Os in a 780-FBGA (29×29) FCBGA package, optimized for surface-mount assembly and dense board layouts.
  • Core Voltage Range — Supported supply range of 0.860 V to 1.15 V, enabling selectable core voltage operation.
  • Commercial Temperature Grade — Rated for 0°C to 85°C operation suitable for commercial applications.
  • Power and Integration (Family Features) — Stratix III device family features Programmable Power Technology and selectable core voltage to balance performance and power.
  • DSP and Performance (Family Features) — Family includes high-speed DSP blocks for dedicated multipliers and MAC functions for signal-processing tasks.
  • Clocking and Timing (Family Features) — Family support for multiple global, regional, and peripheral clocks and up to 12 PLLs for flexible clock management.
  • Signal Integrity and High-Speed I/O (Family Features) — Modular I/O banks, dynamic on-chip termination, and SERDES/DPA circuitry for high-speed differential interfaces.
  • Security and Reliability (Family Features) — Optional 256-bit AES configuration encryption, CRC for configuration memory error detection, and ECC for memory error correction.
  • Compliance — RoHS compliant.

Typical Applications

  • High-Performance DSP — Implement FIR filters, multiply–accumulate chains, and other DSP tasks using the Stratix III family’s dedicated DSP resources.
  • Embedded Systems — Integrate custom processors, peripherals, and memory controllers where on-chip logic and memory reduce external BOM.
  • High-Speed Interfaces — Support serializer/deserializer and differential I/O designs for networking and communications subsystems.
  • Custom Logic and Acceleration — Offload compute-intensive functions to programmable logic for application-specific acceleration in commercial products.

Unique Advantages

  • High Logic Density: 107,500 logic elements provide the capacity to implement large, complex designs on a single device.
  • Substantial On-Chip Memory: Approximately 8.94 Mbits of embedded RAM reduces dependency on external memory for buffering and intermediate storage.
  • Flexible I/O in a Compact Package: 488 user I/Os in a 780-FBGA (29×29) package enable dense board integration while preserving flexible I/O bank configurations.
  • Selectable Core Voltage: Supported supply range from 0.860 V to 1.15 V lets designs trade between lower power and higher performance modes.
  • Family-Level Reliability Features: Optional AES encryption, CRC configuration checking, and ECC for block memory improve design robustness and data integrity.
  • Commercial-Grade Operation: Rated for 0°C to 85°C operation and RoHS compliant to meet standard commercial product requirements.

Why Choose EP3SE110F780C4LG?

The EP3SE110F780C4LG combines substantial programmable logic, significant embedded memory, and a wide range of I/O in a compact 780-ball FCBGA package. It aligns with Stratix III family capabilities for power-managed operation, DSP acceleration, and advanced I/O, making it suitable for commercial designs that require programmable performance and on-chip resources.

This device is appropriate for engineering teams developing high-performance logic, DSP, and embedded systems who need a scalable, well-featured FPGA platform with family-level security and error-detection options and readily integrable I/O and clocking resources.

Request a quote or submit an inquiry to receive pricing and availability information for EP3SE110F780C4LG.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up