EP3SE110F780C4LG
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 604 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4300 | Number of Logic Elements/Cells | 107500 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 8936448 |
Overview of EP3SE110F780C4LG – Field Programmable Gate Array (FPGA) IC
The EP3SE110F780C4LG is a Stratix III family FPGA offering high logic capacity and on-chip memory in a 780-ball FCBGA package. It is intended for high-performance logic, digital signal processing (DSP), and embedded applications that require substantial programmable resources, flexible I/O, and selectable core-voltage operation.
With 107,500 logic elements, approximately 8.94 Mbits of embedded memory, and 488 user I/Os, this surface-mount device targets designs that demand dense logic integration, significant on-chip storage, and commercial-grade operating conditions.
Key Features
- Logic Capacity — 107,500 logic elements to implement complex programmable logic and state machines.
- Embedded Memory — Total on-chip RAM of 8,936,448 bits (approximately 8.94 Mbits) for wide FIFOs, buffers, and memory-mapped logic.
- I/O and Packaging — 488 user I/Os in a 780-FBGA (29×29) FCBGA package, optimized for surface-mount assembly and dense board layouts.
- Core Voltage Range — Supported supply range of 0.860 V to 1.15 V, enabling selectable core voltage operation.
- Commercial Temperature Grade — Rated for 0°C to 85°C operation suitable for commercial applications.
- Power and Integration (Family Features) — Stratix III device family features Programmable Power Technology and selectable core voltage to balance performance and power.
- DSP and Performance (Family Features) — Family includes high-speed DSP blocks for dedicated multipliers and MAC functions for signal-processing tasks.
- Clocking and Timing (Family Features) — Family support for multiple global, regional, and peripheral clocks and up to 12 PLLs for flexible clock management.
- Signal Integrity and High-Speed I/O (Family Features) — Modular I/O banks, dynamic on-chip termination, and SERDES/DPA circuitry for high-speed differential interfaces.
- Security and Reliability (Family Features) — Optional 256-bit AES configuration encryption, CRC for configuration memory error detection, and ECC for memory error correction.
- Compliance — RoHS compliant.
Typical Applications
- High-Performance DSP — Implement FIR filters, multiply–accumulate chains, and other DSP tasks using the Stratix III family’s dedicated DSP resources.
- Embedded Systems — Integrate custom processors, peripherals, and memory controllers where on-chip logic and memory reduce external BOM.
- High-Speed Interfaces — Support serializer/deserializer and differential I/O designs for networking and communications subsystems.
- Custom Logic and Acceleration — Offload compute-intensive functions to programmable logic for application-specific acceleration in commercial products.
Unique Advantages
- High Logic Density: 107,500 logic elements provide the capacity to implement large, complex designs on a single device.
- Substantial On-Chip Memory: Approximately 8.94 Mbits of embedded RAM reduces dependency on external memory for buffering and intermediate storage.
- Flexible I/O in a Compact Package: 488 user I/Os in a 780-FBGA (29×29) package enable dense board integration while preserving flexible I/O bank configurations.
- Selectable Core Voltage: Supported supply range from 0.860 V to 1.15 V lets designs trade between lower power and higher performance modes.
- Family-Level Reliability Features: Optional AES encryption, CRC configuration checking, and ECC for block memory improve design robustness and data integrity.
- Commercial-Grade Operation: Rated for 0°C to 85°C operation and RoHS compliant to meet standard commercial product requirements.
Why Choose EP3SE110F780C4LG?
The EP3SE110F780C4LG combines substantial programmable logic, significant embedded memory, and a wide range of I/O in a compact 780-ball FCBGA package. It aligns with Stratix III family capabilities for power-managed operation, DSP acceleration, and advanced I/O, making it suitable for commercial designs that require programmable performance and on-chip resources.
This device is appropriate for engineering teams developing high-performance logic, DSP, and embedded systems who need a scalable, well-featured FPGA platform with family-level security and error-detection options and readily integrable I/O and clocking resources.
Request a quote or submit an inquiry to receive pricing and availability information for EP3SE110F780C4LG.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018