EP3SE110F780I3

The EP3SE110F780I3 is an Intel Stratix® III E field-programmable gate array (FPGA) offered in a 780-ball FCBGA package. It delivers substantial on-chip logic capacity and embedded memory in a surface-mount, industrial-grade device.

With 107,500 logic elements, approximately 8.9 Mbits of embedded RAM, and 488 I/Os, this FPGA addresses applications that require large configurable logic arrays, significant on-chip storage, and broad external connectivity within an industrial temperature range.

Key Features

• Core Logic Capacity — 107,500 logic elements provide a high level of programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 8.9 Mbits of on-chip RAM to support buffering, state storage, and local data processing without external memory dependency.
• I/O Density — 488 I/O pins enable connectivity to a wide range of peripherals, sensors, and external interfaces.
• Power Supply — Core voltage supply range from 860 mV to 1.15 V, allowing configuration within specified system power rails.
• Package and Mounting — 780-ball FCBGA (780-FBGA, 29 × 29) in a surface-mount package for compact, high-density PCB implementations.
• Industrial Grade and Temperature Range — Rated for industrial use with an operating temperature range of −40 °C to 100 °C.
• Regulatory — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Industrial Control and Automation — Use the device’s large logic capacity and embedded RAM to implement custom control algorithms, signal conditioning, and interfacing for machinery and process control systems.
• Communications and Networking Equipment — Leverage the high I/O count and substantial on-chip resources for protocol handling, data buffering, and parallel IO processing in networked devices.
• High-Density Embedded Systems — Compact FCBGA packaging and surface-mount design support space-constrained embedded platforms that require significant programmable logic and memory.

Unique Advantages

• High Integration Density: 107,500 logic elements enable implementation of large, complex logic functions on a single device, reducing the need for multiple FPGAs.
• Substantial On-Chip Memory: Approximately 8.9 Mbits of embedded RAM supports local data storage and reduces external memory bandwidth requirements.
• Broad External Connectivity: 488 I/Os provide flexibility for interfacing to many peripherals and parallel signal paths, simplifying board-level design.
• Industrial Operating Range: Rated from −40 °C to 100 °C, suitable for demanding environmental conditions commonly found in industrial deployments.
• Compact Surface-Mount Package: 780-FBGA (29 × 29) enables high-density PCB layouts while maintaining robust mechanical mounting for industrial boards.
• Environmentally Compliant: RoHS compliance helps meet regulatory and sustainability requirements.

Why Choose EP3SE110F780I3?

The EP3SE110F780I3 combines substantial programmable logic resources, significant embedded memory, and a high I/O count in a compact industrial-grade FCBGA package. This combination provides the integration and flexibility required for complex, space-constrained designs that operate across a wide temperature range.

Manufactured by Intel and specified for industrial use, the device is suited to engineering teams building robust, scalable systems that require on-board programmability, local buffering, and extensive external interfacing.

Request a quote or submit an inquiry for the EP3SE110F780I3 to check availability, lead times, and pricing for your next design.