EP3SE110F780I3G

IC FPGA 488 I/O 780FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 892 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4300Number of Logic Elements/Cells107500
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits8936448

Overview of EP3SE110F780I3G – Field Programmable Gate Array (FPGA) IC

The EP3SE110F780I3G is an Intel Stratix III family FPGA offering a balance of high logic capacity and embedded memory for demanding digital logic, DSP and embedded designs. Built on the Stratix III architecture, the device targets high-performance, low-power applications that require extensive logic resources, fast I/O and robust system integration.

Key device attributes include 107,500 logic elements, approximately 8.9 Mbits of embedded memory, 488 user I/O pins in a 780‑FBGA (29×29) package, and industrial-grade operation across a −40 °C to 100 °C temperature range with a selectable core supply range of 0.860 V to 1.15 V.

Key Features

  • Logic Capacity 107,500 logic elements provide substantial programmable fabric for complex logic, state machines and control functions.
  • Embedded Memory Approximately 8.9 Mbits of on-chip RAM for FIFOs, buffers and on-chip data storage to support data-centric designs.
  • I/O and Packaging 488 user I/O pins in a 780‑FBGA (29×29) surface-mount package offer dense interfacing options while supporting modular I/O bank architectures.
  • Power and Voltage Core supply range from 0.860 V to 1.15 V enables selectable core voltage operation to balance performance and power consumption.
  • Industrial Temperature Grade Qualified for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature coverage.
  • DSP and Arithmetic Support Stratix III family architecture includes high-speed DSP capabilities (multiplier and MAC support) for signal processing and compute-heavy tasks.
  • Clocking and Timing Family-level support for multiple global, regional and peripheral clocks plus integrated PLLs for flexible clock management and synthesis.
  • System Reliability and Security Stratix III family features such as configuration memory error detection and optional AES key support provide additional system reliability and security options.
  • Standards and Interfaces Family documentation describes support for high-speed serial interfaces and memory interfaces, enabling network and external-memory connectivity in system designs.
  • Compliance RoHS compliant for environmental requirements.

Typical Applications

  • High‑Performance Signal Processing Use the device’s DSP resources and large logic fabric for FIR filters, FFTs and real-time data processing pipelines.
  • Networking and Communications Dense I/O and Stratix III serial/interface support make it suitable for protocol processing, packet handling and line-rate interfacing.
  • Memory Interface Controllers Embedded memory and dedicated I/O bank features enable implementation of DDR/DDR2/DDR3 and other external memory interfaces.
  • Embedded System Integration Implement custom peripherals, glue logic, and soft processors to consolidate functions and reduce BOM in industrial embedded platforms.

Unique Advantages

  • Large, Programmable Fabric: 107,500 logic elements support complex logic integration and feature-rich designs on a single device.
  • Significant On‑Chip Memory: Approximately 8.9 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
  • Flexible Power Scaling: Selectable core voltage range (0.860 V–1.15 V) allows designers to tune the device for performance or lower power operation.
  • Industrial Reliability: Operation from −40 °C to 100 °C and RoHS compliance support deployment in industrial-grade environments.
  • High‑Density I/O in a Compact Package: 488 I/O in a 780‑FBGA (29×29) package enables dense board-level connectivity while maintaining a compact footprint.
  • Family-Level Ecosystem: Stratix III architecture features—such as clock management, DSP blocks and configuration integrity features—simplify system-level design and validation.

Why Choose EP3SE110F780I3G?

The EP3SE110F780I3G combines a large programmable logic count, multi-megabit on-chip memory and substantial I/O density in an industrial-grade Stratix III FPGA. Its selectable core voltage and family-provided features for DSP, clocking and configuration integrity make it well suited for designers building high-performance DSP, networking, memory-interface and embedded control applications that require long-term robustness and flexible power/performance trade-offs.

This device is appropriate for engineering teams seeking a scalable FPGA platform with proven architecture and the system-level features documented in the Stratix III device handbook.

Request a quote or submit your pricing and availability inquiry to evaluate EP3SE110F780I3G for your next design.

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