EP3SE110F780I3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 892 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4300 | Number of Logic Elements/Cells | 107500 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 8936448 |
Overview of EP3SE110F780I3G – Field Programmable Gate Array (FPGA) IC
The EP3SE110F780I3G is an Intel Stratix III family FPGA offering a balance of high logic capacity and embedded memory for demanding digital logic, DSP and embedded designs. Built on the Stratix III architecture, the device targets high-performance, low-power applications that require extensive logic resources, fast I/O and robust system integration.
Key device attributes include 107,500 logic elements, approximately 8.9 Mbits of embedded memory, 488 user I/O pins in a 780‑FBGA (29×29) package, and industrial-grade operation across a −40 °C to 100 °C temperature range with a selectable core supply range of 0.860 V to 1.15 V.
Key Features
- Logic Capacity 107,500 logic elements provide substantial programmable fabric for complex logic, state machines and control functions.
- Embedded Memory Approximately 8.9 Mbits of on-chip RAM for FIFOs, buffers and on-chip data storage to support data-centric designs.
- I/O and Packaging 488 user I/O pins in a 780‑FBGA (29×29) surface-mount package offer dense interfacing options while supporting modular I/O bank architectures.
- Power and Voltage Core supply range from 0.860 V to 1.15 V enables selectable core voltage operation to balance performance and power consumption.
- Industrial Temperature Grade Qualified for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature coverage.
- DSP and Arithmetic Support Stratix III family architecture includes high-speed DSP capabilities (multiplier and MAC support) for signal processing and compute-heavy tasks.
- Clocking and Timing Family-level support for multiple global, regional and peripheral clocks plus integrated PLLs for flexible clock management and synthesis.
- System Reliability and Security Stratix III family features such as configuration memory error detection and optional AES key support provide additional system reliability and security options.
- Standards and Interfaces Family documentation describes support for high-speed serial interfaces and memory interfaces, enabling network and external-memory connectivity in system designs.
- Compliance RoHS compliant for environmental requirements.
Typical Applications
- High‑Performance Signal Processing Use the device’s DSP resources and large logic fabric for FIR filters, FFTs and real-time data processing pipelines.
- Networking and Communications Dense I/O and Stratix III serial/interface support make it suitable for protocol processing, packet handling and line-rate interfacing.
- Memory Interface Controllers Embedded memory and dedicated I/O bank features enable implementation of DDR/DDR2/DDR3 and other external memory interfaces.
- Embedded System Integration Implement custom peripherals, glue logic, and soft processors to consolidate functions and reduce BOM in industrial embedded platforms.
Unique Advantages
- Large, Programmable Fabric: 107,500 logic elements support complex logic integration and feature-rich designs on a single device.
- Significant On‑Chip Memory: Approximately 8.9 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
- Flexible Power Scaling: Selectable core voltage range (0.860 V–1.15 V) allows designers to tune the device for performance or lower power operation.
- Industrial Reliability: Operation from −40 °C to 100 °C and RoHS compliance support deployment in industrial-grade environments.
- High‑Density I/O in a Compact Package: 488 I/O in a 780‑FBGA (29×29) package enables dense board-level connectivity while maintaining a compact footprint.
- Family-Level Ecosystem: Stratix III architecture features—such as clock management, DSP blocks and configuration integrity features—simplify system-level design and validation.
Why Choose EP3SE110F780I3G?
The EP3SE110F780I3G combines a large programmable logic count, multi-megabit on-chip memory and substantial I/O density in an industrial-grade Stratix III FPGA. Its selectable core voltage and family-provided features for DSP, clocking and configuration integrity make it well suited for designers building high-performance DSP, networking, memory-interface and embedded control applications that require long-term robustness and flexible power/performance trade-offs.
This device is appropriate for engineering teams seeking a scalable FPGA platform with proven architecture and the system-level features documented in the Stratix III device handbook.
Request a quote or submit your pricing and availability inquiry to evaluate EP3SE110F780I3G for your next design.

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