EP3SE110F780I4L

IC FPGA 488 I/O 780FBGA
Part Description

Stratix® III E Field Programmable Gate Array (FPGA) IC 488 8936448 107500 780-BBGA, FCBGA

Quantity 749 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4300Number of Logic Elements/Cells107500
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits8936448

Overview of EP3SE110F780I4L – Stratix® III E FPGA, 780‑BBGA FCBGA

The EP3SE110F780I4L is a Stratix® III E Field Programmable Gate Array (FPGA) offering high-density programmable logic with 107,500 logic elements and approximately 8.9 Mbits of embedded memory. Designed for surface-mount board assembly in a 780‑BBGA (29×29) package, this industrial‑grade FPGA provides a large number of I/O and broad operating conditions for demanding designs.

With 488 general-purpose I/O pins, a low-voltage supply range of 0.86 V to 1.15 V, and an operating temperature range from −40 °C to 100 °C, this device targets applications that require substantial on-chip logic and memory resources combined with industrial temperature robustness.

Key Features

  • Core Logic 107,500 logic elements to implement complex digital functions and programmable logic fabrics.
  • Embedded Memory Approximately 8.9 Mbits of on-chip RAM for data buffering, state storage, and local memory needs.
  • I/O Capacity 488 user I/O pins to support wide external interfacing and system integration.
  • Power Operates from a core supply range of 0.86 V to 1.15 V to match modern low-voltage power rails.
  • Package & Mounting 780‑BBGA (supplier device package: 780‑FBGA, 29×29) in a surface-mount form factor for compact PCB designs.
  • Temperature & Grade Industrial grade device rated for −40 °C to 100 °C operating temperature ranges.
  • Environmental Compliance RoHS compliant for adherence to common lead-free manufacturing requirements.

Unique Advantages

  • High integration density: 107,500 logic elements and ~8.9 Mbits of embedded RAM enable consolidation of multiple functions onto a single device, reducing board-level component count.
  • Extensive I/O resources: 488 I/O pins support complex peripheral and I/O routing without immediate need for external I/O expanders.
  • Industrial temperature capability: Rated from −40 °C to 100 °C for reliability in temperature-challenging environments.
  • Compact surface-mount package: 780‑BBGA (29×29) footprint balances high pin count with a space-efficient form factor for dense PCBs.
  • Low-voltage core operation: 0.86 V to 1.15 V supply compatibility supports modern power-rail architectures and can simplify power-supply design.
  • RoHS compliant: Meets lead-free manufacturing requirements for environmental and regulatory considerations.

Why Choose EP3SE110F780I4L?

The EP3SE110F780I4L positions itself as a high-capacity, industrial-grade FPGA solution for designs that require substantial on-chip logic, significant embedded memory, and a high I/O count in a compact surface-mount package. Its combination of 107,500 logic elements, approximately 8.9 Mbits of RAM, and 488 I/O makes it suitable for integration-heavy projects where board space and component consolidation are priorities.

Engineers and procurement teams seeking a robust programmable logic device with defined industrial temperature range and RoHS compliance will find this part appropriate for applications demanding long-term operational stability and high integration density.

Request a quote or submit your requirements to receive pricing and availability for the EP3SE110F780I4L.

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