EP3SE110F780I4LG

The EP3SE110F780I4LG is an Intel Stratix III family FPGA offering high-density programmable logic and on-chip memory for demanding logic, DSP, and embedded applications. Built for surface-mount deployment in a 780-FBGA (29×29) package, this industrial-grade device delivers a balance of logic resources, embedded memory, and flexible I/O for system-level integration.

Typical target uses include high-performance logic and digital signal processing, memory-interface control, and high-speed communications where on-chip security and reliability features are required.

Key Features

• Logic Capacity  107,500 logic elements provide substantial programmable logic resources for complex designs and system integration.
• Embedded Memory  Approximately 8.94 Mbits of on-chip RAM (8,936,448 total bits) to implement FIFOs, buffers, and data-path storage without external memory.
• I/O and Packaging  488 user I/O pins in a 780-FBGA (29×29) surface-mount package enable broad interfacing options while supporting compact board layouts.
• Voltage and Power  Core voltage range from 860 mV to 1.15 V, allowing selectable core operating points to balance performance and power.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Programmable Clocking and PLLs  Family-level support for multiple global, regional, and peripheral clocks and up to 12 PLLs for clock synthesis, switchover, and dynamic phase control.
• DSP and Multiplier Support  Stratix III family DSP blocks provide dedicated multiplier and MAC resources for efficient implementation of signal processing functions.
• High-speed I/O and Memory Interfaces  Family-level support for SERDES, dynamic phase alignment, and high-speed external memory interfaces (DDR, DDR2, DDR3, RLDRAM II, QDR II/II+), enabling high-throughput links and memory controllers.
• Security and Reliability  Stratix III family features include optional 256-bit AES encryption for configuration bitstream security, configuration CRC, and ECC circuitry for on-chip memory error detection and correction.
• Standards and Integration  Family-level support for networking and communications standards (including 10 Gigabit Ethernet XSBI and other common protocols) and embedded processor support (Nios II) for system-level integration.
• RoHS Compliant  Device is RoHS compliant to meet environmental requirements.

Typical Applications

• High-performance DSP and Signal Processing  Use the device’s dedicated DSP resources and large logic fabric to implement FIR filters, FFTs, and other compute-intensive signal-processing pipelines.
• High-speed Communications  Leverage SERDES support, dynamic phase alignment, and protocol megafunctions to implement network interfaces and high-throughput links such as 10 Gigabit Ethernet.
• Memory Interface Controllers  Implement controllers and data-paths for DDR/DDR2/DDR3 and specialized SRAM interfaces using on-chip memory, dedicated DQS logic, and modular I/O banks.
• Embedded Systems and SoC Integration  Integrate soft processors (Nios II) and megafunction IP to create custom embedded subsystems with on-chip security and diagnostics.

Unique Advantages

• High Logic Density: 107,500 logic elements enable complex designs to be implemented on a single device, reducing external glue logic and system BOM.
• Significant On-chip Memory: Approximately 8.94 Mbits of embedded RAM support large buffers and SRAM-like storage without off-chip memory for many applications.
• Flexible I/O in a Compact Package: 488 I/O pins in a 780-FBGA (29×29) surface-mount package balance high connectivity with board-level density.
• Industrial Operating Range: −40 °C to 100 °C rating and industrial grade designation support deployment in harsh and industrial environments.
• Security and Reliability Built In: Optional 256-bit AES configuration encryption, configuration CRC, and ECC on embedded memory increase design robustness and protect intellectual property.
• Broad Interface and IP Support: Family-level support for high-speed memory interfaces, networking standards, and embedded processor IP simplifies integration into complex systems.

Why Choose EP3SE110F780I4LG?

The EP3SE110F780I4LG combines substantial logic and memory resources with broad I/O capability and industrial thermal rating, making it a practical choice for designers building high-performance DSP, networking, and embedded systems that require on-chip security and reliability features. Its selectable voltage range and family-level clocking/PLL resources provide design flexibility to balance performance and power.

This device is suited to engineering teams that need a scalable, programmable platform with strong integration potential—reducing external components while leveraging Stratix III family features for memory interfaces, communications protocols, and embedded processing support.

If you would like pricing, availability, or technical sales support for the EP3SE110F780I4LG, request a quote or submit an inquiry to discuss your project requirements.