EP3SE110F780I4N

The EP3SE110F780I4N is a Stratix® III E field programmable gate array (FPGA) offered in a 780‑BBGA FCBGA package. It provides a large programmable fabric with 107,500 logic elements and approximately 8.94 Mbits of embedded memory, enabling complex custom digital functions and on-chip data storage.

With 488 I/O pins, a supply voltage range of 860 mV to 1.15 V, surface‑mount packaging, and industrial temperature grading (−40 °C to 100 °C), this device targets designs that require high logic capacity, significant embedded RAM, and extended temperature operation.

Key Features

• Programmable Logic Capacity — 107,500 logic elements to implement complex custom logic, state machines, and datapaths.
• Embedded Memory — Approximately 8.94 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Resources — 488 general I/O pins to interface with multiple peripherals, busses, and external devices.
• Power — Core voltage support from 860 mV to 1.15 V, suitable for designs targeting this supply range.
• Package & Mounting — 780‑BBGA FCBGA footprint; supplier device package 780‑FBGA (29×29); surface‑mount assembly compatible.
• Temperature & Grade — Industrial grade operation from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Compliance — RoHS‑compliant construction for regulatory and sourcing needs.

Typical Applications

• Logic‑ and memory‑intensive designs — Use the large logic element count and embedded RAM for complex custom processing, protocol handling, or hardware acceleration.
• High‑I/O interfacing — 488 I/Os enable multi‑device connectivity, parallel interfaces, and dense board‑level integration.
• Industrial systems — Industrial temperature rating supports deployment in temperature‑varied control and automation equipment.

Unique Advantages

• Substantial programmable fabric: 107,500 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing board complexity.
• On‑chip memory availability: Approximately 8.94 Mbits of embedded RAM reduces dependence on external memory components and improves data locality.
• Extensive I/O count: 488 I/Os offer flexibility for multi‑channel interfaces, custom pinouts, and parallel data paths.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in harsh or variable thermal conditions.
• Compact BGA package: 780‑BBGA / 780‑FBGA (29×29) package supports dense PCB layouts and surface‑mount assembly.
• RoHS compliance: Meets lead‑free and hazardous substance restrictions for regulated manufacturing and procurement.

Why Choose EP3SE110F780I4N?

The EP3SE110F780I4N combines a large logic element count with significant embedded RAM and a high I/O count in a surface‑mount 780‑FBGA package, making it well suited for designs that require substantial on‑chip resources and dense external connectivity. Its industrial temperature grading and RoHS compliance support robust, regulation‑aware product deployments.

This device is appropriate for engineering teams seeking to consolidate functionality, reduce external memory and I/O component needs, and target applications that must operate across a wide temperature range while maintaining a compact PCB footprint.

Request a quote or submit an inquiry for EP3SE110F780I4N to receive pricing, lead‑time, and availability information tailored to your project requirements.