EP3SE110F780I4LN

The EP3SE110F780I4LN is an Intel Stratix® III E Field Programmable Gate Array (FPGA) in a 780-BBGA FCBGA package. It delivers a large logic capacity together with substantial on-chip memory and a high I/O count for complex digital designs.

Targeted at industrial applications, the device is specified for surface-mount assembly and operates over a core voltage range of 860 mV to 1.15 V and an operating temperature range of −40 °C to 100 °C, supporting designs that require robust thermal and power headroom.

Key Features

• Logic Capacity  107,500 logic elements to implement complex combinational and sequential logic.
• Logic Array Blocks  4,300 LABs for organized logic grouping and design partitioning.
• Embedded Memory  Approximately 8.94 Mbits of on-chip RAM for buffering, frame storage, and state retention without immediate reliance on external memory.
• I/O Density  488 user I/Os to support high-pin-count interfaces and multiple parallel buses.
• Power  Core voltage supply range from 860 mV to 1.15 V to match system power domains and regulator choices.
• Package & Mounting  780-BBGA (780-FBGA, 29×29) in a surface-mount form factor for compact, high-density PCB layouts.
• Operating Range  Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Compliance  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Industrial Automation  Implements control logic and custom state machines where industrial temperature range and high I/O counts are required.
• Communications Infrastructure  Supports protocol handling and data-path logic with large logic capacity and significant on-chip RAM for buffering.
• Data Acquisition & Signal Processing  Provides local aggregation and pre-processing using embedded RAM and abundant logic elements to implement filters and capture logic.
• Custom Hardware Acceleration  Enables integration of custom accelerators and interface bridging in a single FPGA package to reduce BOM and board complexity.

Unique Advantages

• Large integrated logic resource: 107,500 logic elements reduce the need for multi-device partitioning in complex designs.
• Substantial on-chip memory: Approximately 8.94 Mbits of embedded RAM lowers dependence on external memory for intermediate buffering and state storage.
• High I/O count: 488 I/Os enable rich peripheral and bus connectivity without external multiplexing.
• Industrial operating range: Rated from −40 °C to 100 °C to meet many industrial environmental requirements.
• Space-efficient package: 780-FBGA (29×29) surface-mount package supports dense PCB layouts while accommodating high pin counts.
• RoHS compliant: Supports lead-free manufacturing flows and environmental compliance needs.

Why Choose EP3SE110F780I4LN?

The EP3SE110F780I4LN positions itself as a high-capacity FPGA option within the Stratix® III E family, combining extensive logic resources, sizable embedded memory, and a broad I/O matrix in a compact BGA package. Its industrial temperature rating and surface-mount footprint make it suitable for systems that demand integration, durability, and a high degree of customization.

Designers and procurement teams looking to consolidate multiple functions into a single programmable device will find this part appropriate for applications that require large logic counts, significant on-chip RAM, and high connector density while maintaining RoHS compliance and established vendor ecosystem support.

Request a quote or submit an inquiry for pricing and availability of EP3SE110F780I4LN to evaluate it for your next design.