EP3SE260F1152C2N

The EP3SE260F1152C2N is a Stratix® III E field programmable gate array (FPGA) from Intel, packaged in a 1152-ball BGA (35×35) for surface-mount applications. It delivers a large on-chip resource set including logic elements, embedded RAM, and extensive I/O count.

Designed for designs that require substantial logic capacity, embedded memory, and many external interfaces, this commercial-grade device supports core voltage operation from 0.860 V to 1.15 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Architecture  Stratix® III E FPGA with 255,000 logic elements and 10,200 LABs for complex digital implementations.
• Embedded Memory  Approximately 16.7 Mbits of on-chip RAM (16,672,768 total RAM bits) for buffering and local data storage.
• I/O Capacity  744 I/O pins to support extensive external interfacing without excessive external multiplexing.
• Power  Core voltage range of 0.860 V to 1.15 V to match system power architectures.
• Package & Mounting  1152-BBGA (FCBGA, 35×35) supplier device package designed for surface-mount assembly.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Large-scale digital implementations  Deploy substantial logic networks and consolidated functions using 255,000 logic elements.
• High-channel I/O systems  Support systems with numerous external interfaces using 744 I/O pins.
• On-chip buffering and data handling  Use approximately 16.7 Mbits of embedded RAM for local buffering, FIFOs, and intermediate storage.

Unique Advantages

• High logic capacity: 255,000 logic elements allow integration of complex functions into a single device, reducing the need for multiple ICs.
• Substantial on-chip memory: Approximately 16.7 Mbits of embedded RAM lowers dependency on external memory components for many designs.
• Extensive I/O count: 744 I/O pins simplify board-level connectivity and reduce external interface hardware.
• Compact high-pin-count package: 1152-BBGA (35×35) provides a dense footprint for designs that require many signals in a constrained area.
• Commercial-grade operating range: Rated 0 °C to 85 °C to meet standard commercial application environments.
• RoHS compliant: Meets common environmental compliance requirements.

Why Choose EP3SE260F1152C2N?

The EP3SE260F1152C2N combines a large pool of logic elements, substantial embedded RAM, and a high I/O count in a single 1152-BBGA surface-mount package, making it well suited to designs that need significant on-chip resources and dense board-level connectivity. Its commercial temperature rating and RoHS compliance align it with standard electronic product requirements.

Choose this Stratix® III E device when your design demands scalable logic capacity, extensive I/O, and on-chip memory to consolidate functions and simplify system architecture.

Request a quote or submit your requirements now to receive pricing and availability for the EP3SE260F1152C2N.