EP3SE260F1152C3G

The EP3SE260F1152C3G is a Stratix III family FPGA device offering high-density programmable logic and on-chip memory for demanding digital designs. It targets high-performance logic, digital signal processing (DSP) and embedded system applications where a balance of logic capacity, memory and flexible I/O is required.

Designed with selectable core-voltage and power-optimization features from the Stratix III family, this commercial-grade, surface-mount FCBGA device delivers a combination of large logic capacity, substantial embedded memory and a broad I/O complement for system integration.

Key Features

• High logic capacity — 255,000 logic elements to implement complex combinational and sequential logic functions.
• Embedded memory — Approximately 16.7 Mbits of on-chip RAM for FIFOs, buffers and local storage.
• I/O and package — Up to 744 user I/O pins in a 1152-FBGA (35×35) package, surface-mount mounting for dense PCB integration.
• Core voltage range — Operates with a core supply from 0.86 V to 1.15 V to support selectable performance and power targets.
• Commercial temperature grade — Rated for 0 °C to 85 °C for standard commercial deployments.
• Stratix III family architecture — Includes family-level capabilities such as Programmable Power Technology, selectable core voltage and support for timing and clocking resources described in the Stratix III device handbook.
• Reliability and security features — Stratix III family devices include configuration memory error detection and optional 256-bit AES encryption as described in the datasheet.
• Standards and compliance — RoHS compliant.

Typical Applications

• High-performance DSP — Implement multiply-accumulate pipelines, filters and other signal-processing functions using the device’s large logic and on-chip memory resources.
• Embedded processing and acceleration — Offload compute-intensive tasks from processors using programmable logic and integrated memory.
• Network and communications interfaces — Use the abundant user I/O to implement custom protocol bridges, packet processing or interface logic.
• Memory interface controllers — Leverage the on-chip memory and modular I/O banks for building external memory controllers and buffering logic.

Unique Advantages

• Large programmable fabric: 255,000 logic elements provide capacity for complex system-on-chip implementations and parallel datapaths.
• Substantial embedded memory: Approximately 16.7 Mbits of RAM reduces external memory dependence for intermediate buffering and FIFOs.
• Extensive I/O connectivity: 744 user I/O pins in a compact 1152-FBGA package facilitate high-density board-level connectivity and modular I/O bank usage.
• Configurable power-performance trade-offs: Core supply range of 0.86 V to 1.15 V and Stratix III power-management features allow tuning for performance or power savings.
• Family-level reliability and security: Stratix III family features such as configuration error detection, ECC for memory blocks and optional 256-bit AES help protect designs and support high-availability use cases.

Why Choose EP3SE260F1152C3G?

The EP3SE260F1152C3G positions itself as a high-density Stratix III FPGA option for designers who need large logic capacity, significant embedded memory and broad I/O in a commercial-grade, surface-mount package. Its selectable core voltage and family power technologies enable designers to balance performance and power per their application needs.

With Stratix III family ecosystem support and built-in reliability and security features documented in the device handbook, this FPGA is a practical choice for teams developing DSP workloads, high-throughput interfaces, embedded accelerators and memory controller logic that require on-chip resources and flexible integration.

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