EP3SE260F1152C4G

The EP3SE260F1152C4G is a Stratix III family FPGA offering high-performance, low-power programmable logic in a 1152‑FBGA package. It provides a large logic and memory fabric suitable for compute- and memory-intensive embedded designs, communications and networking subsystems, and signal processing acceleration.

Designed for commercial applications, this device features approximately 255,000 logic elements, roughly 16.7 Mbits of on-chip RAM, and up to 744 user I/O pins. Core voltage is selectable within an 860 mV to 1.15 V range and the device is specified for 0 °C to 85 °C operation.

Key Features

• Logic Capacity  Approximately 255,000 logic elements and 10,200 logic array blocks enable complex custom logic and deep datapath implementations.
• Embedded Memory  Approximately 16.7 Mbits of on-chip RAM suitable for FIFOs, buffers, and local data storage.
• I/O and Package  Up to 744 user I/O pins in a 1152‑FBGA (35×35) surface-mount package for dense system integration and wide connectivity options.
• Power and Voltage  Selectable core operation with supply range from 860 mV to 1.15 V to balance performance and power consumption.
• Clocking and Timing  Support for multiple global, regional, and peripheral clocks and on-device PLL resources for flexible clock management (series-level feature).
• High-speed I/O Support  Stratix III architecture includes high-speed differential I/O, SERDES, and dynamic alignment features suitable for networking and high-bandwidth interfaces (series-level feature).
• System Reliability and Security  Series-level features include configuration CRC and optional 256-bit AES encryption for configuration bitstream protection, plus ECC and error detection for on-chip memory.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial deployments.

Typical Applications

• Communications and Networking  Use the device for protocol processing, packet handling, and high-speed interface bridging where large logic capacity and high-speed I/O are required.
• Digital Signal Processing  Implement FIR filters, accelerators, and DSP pipelines leveraging the device’s large logic fabric and abundant embedded RAM.
• Memory Interface Controllers  Build controllers and interfaces for external memory technologies using the device’s modular I/O banks and memory interface support (series-level feature).
• Embedded Systems and Prototyping  Deploy as a programmable hardware platform for system integration, prototyping, and custom hardware acceleration in commercial products.

Unique Advantages

• High logic and memory density: The combination of ~255,000 logic elements and ~16.7 Mbits of RAM reduces the need for external memory and enables complex on-chip functions.
• Flexible I/O integration: Up to 744 user I/O in a 1152‑FBGA package simplifies board routing while supporting a wide range of interfaces and bank configurations.
• Configurable power/performance trade-offs: Selectable core voltage (860 mV–1.15 V) lets designers tune the device for higher performance or lower power depending on system needs.
• Enhanced system reliability and security: Series-level CRC, ECC, and optional 256-bit AES configuration encryption provide mechanisms to protect configuration integrity and on-chip data.
• Commercial-grade supply and compliance: Surface-mount 1152‑FBGA package and RoHS compliance facilitate integration into commercial product lines.

Why Choose EP3SE260F1152C4G?

The EP3SE260F1152C4G positions itself as a high-capacity Stratix III FPGA for commercial embedded and communications designs that require substantial logic resources, significant on-chip RAM, and flexible I/O in a compact FBGA package. Its selectable core voltage and series-level power-management features enable designers to balance performance and power for diverse application requirements.

This device is well suited for teams building complex, memory-heavy FPGA solutions who need proven architecture-level features—such as on-chip ECC, configuration CRC, and AES configuration options—combined with a large number of I/Os and a high-density package for board-level integration.

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