EP3SE260F1152C4LG
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 143 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 744 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 10200 | Number of Logic Elements/Cells | 255000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 16672768 |
Overview of EP3SE260F1152C4LG – Field Programmable Gate Array (FPGA) IC
The EP3SE260F1152C4LG is a Stratix III family FPGA offering a high-density, high-performance programmable fabric for logic, DSP and embedded system designs. It combines a large logic capacity and on-chip memory with scalable core voltage and power-management features to address data-centric computing, high-speed communications, and complex embedded applications.
Key Features
- Logic Capacity Approximately 255,000 logic elements for implementing large-scale combinational and sequential logic and complex control functions.
- Embedded Memory Approximately 16.7 Mbits of on-chip RAM (16,672,768 bits) to support FIFOs, buffers and memory-intensive datapaths.
- DSP and Arithmetic Blocks Dedicated high-speed DSP resources in the Stratix III family for efficient multiply-accumulate operations and FIR filtering (series-level DSP multipliers up to 36×36 at up to 550 MHz as documented in the device family handbook).
- I/O Resources 744 user I/O pins with a modular I/O bank architecture and support for common external memory interface features described for the Stratix III family.
- Power and Voltage Selectable core voltage operation with a documented supply range of 860 mV to 1.15 V and Programmable Power Technology to balance performance and power consumption.
- Package and Mounting 1152-pin FBGA package (35 × 35 mm) in a surface-mount FCBGA-style package for compact system integration.
- Operating Range and Grade Commercial grade device specified for 0 °C to 85 °C operating temperature.
- Security and Reliability (Family Features) Stratix III family support for optional 256-bit AES configuration encryption and built-in configuration memory error detection and correction mechanisms as documented in the device handbook.
- Standards and Compliance RoHS compliant material composition.
Typical Applications
- High‑performance DSP and signal processing: Use the device’s large logic fabric, embedded memory and family DSP blocks to implement filtering, transforms and real‑time processing pipelines.
- Networking and communications: Deploy in systems that require complex protocol handling, packet processing or high‑speed interfaces leveraging the Stratix III family I/O architecture.
- Memory interface controllers: Implement DDR/DDR2/DDR3 or other high‑speed external memory controllers using abundant on‑chip RAM and the family’s dedicated memory interface support.
- Embedded system integration: Combine logic, memory and DSP resources to host custom accelerators, protocol bridges or embedded processor subsystems.
Unique Advantages
- High logic density: Approximately 255,000 logic elements enable consolidation of large functions into a single device, reducing board-level complexity.
- Significant on‑chip memory: Approximately 16.7 Mbits of embedded RAM supports deep buffering and wide datapaths without external memory.
- Flexible core power scaling: Selectable core voltage (860 mV–1.15 V) and Programmable Power Technology allow designers to tune performance versus power for their application.
- Robust I/O and packaging: 744 user I/O pins in a 1152‑FBGA (35×35) package provide ample external connectivity in a compact surface‑mount footprint.
- Built‑in security and reliability features: Family-level support for AES configuration encryption and configuration memory error detection/correction enhances design protection and availability.
- Stratix III ecosystem compatibility: Family-documented support for embedded processors and megafunction IP enables reuse of proven IP and accelerates development.
Why Choose EP3SE260F1152C4LG?
The EP3SE260F1152C4LG places a high-capacity Stratix III FPGA in a compact FBGA package, delivering a combination of logic density, embedded memory and configurable power that suits demanding DSP, communications and embedded applications. Its selectable core voltage and family-level power-management features help designers balance throughput and power consumption within commercial temperature ranges.
This device is well suited for engineers building complex, memory‑rich systems who require a programmable, scalable platform with on-chip security and reliability features. The Stratix III family documentation and IP ecosystem support rapid integration and long-term design scalability.
Request a quote or submit an inquiry for pricing and availability of EP3SE260F1152C4LG to move your design forward.

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