EP3SE260F1152C4LG

IC FPGA 744 I/O 1152FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 143 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10200Number of Logic Elements/Cells255000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits16672768

Overview of EP3SE260F1152C4LG – Field Programmable Gate Array (FPGA) IC

The EP3SE260F1152C4LG is a Stratix III family FPGA offering a high-density, high-performance programmable fabric for logic, DSP and embedded system designs. It combines a large logic capacity and on-chip memory with scalable core voltage and power-management features to address data-centric computing, high-speed communications, and complex embedded applications.

Key Features

  • Logic Capacity  Approximately 255,000 logic elements for implementing large-scale combinational and sequential logic and complex control functions.
  • Embedded Memory  Approximately 16.7 Mbits of on-chip RAM (16,672,768 bits) to support FIFOs, buffers and memory-intensive datapaths.
  • DSP and Arithmetic Blocks  Dedicated high-speed DSP resources in the Stratix III family for efficient multiply-accumulate operations and FIR filtering (series-level DSP multipliers up to 36×36 at up to 550 MHz as documented in the device family handbook).
  • I/O Resources  744 user I/O pins with a modular I/O bank architecture and support for common external memory interface features described for the Stratix III family.
  • Power and Voltage  Selectable core voltage operation with a documented supply range of 860 mV to 1.15 V and Programmable Power Technology to balance performance and power consumption.
  • Package and Mounting  1152-pin FBGA package (35 × 35 mm) in a surface-mount FCBGA-style package for compact system integration.
  • Operating Range and Grade  Commercial grade device specified for 0 °C to 85 °C operating temperature.
  • Security and Reliability (Family Features)  Stratix III family support for optional 256-bit AES configuration encryption and built-in configuration memory error detection and correction mechanisms as documented in the device handbook.
  • Standards and Compliance  RoHS compliant material composition.

Typical Applications

  • High‑performance DSP and signal processing: Use the device’s large logic fabric, embedded memory and family DSP blocks to implement filtering, transforms and real‑time processing pipelines.
  • Networking and communications: Deploy in systems that require complex protocol handling, packet processing or high‑speed interfaces leveraging the Stratix III family I/O architecture.
  • Memory interface controllers: Implement DDR/DDR2/DDR3 or other high‑speed external memory controllers using abundant on‑chip RAM and the family’s dedicated memory interface support.
  • Embedded system integration: Combine logic, memory and DSP resources to host custom accelerators, protocol bridges or embedded processor subsystems.

Unique Advantages

  • High logic density: Approximately 255,000 logic elements enable consolidation of large functions into a single device, reducing board-level complexity.
  • Significant on‑chip memory: Approximately 16.7 Mbits of embedded RAM supports deep buffering and wide datapaths without external memory.
  • Flexible core power scaling: Selectable core voltage (860 mV–1.15 V) and Programmable Power Technology allow designers to tune performance versus power for their application.
  • Robust I/O and packaging: 744 user I/O pins in a 1152‑FBGA (35×35) package provide ample external connectivity in a compact surface‑mount footprint.
  • Built‑in security and reliability features: Family-level support for AES configuration encryption and configuration memory error detection/correction enhances design protection and availability.
  • Stratix III ecosystem compatibility: Family-documented support for embedded processors and megafunction IP enables reuse of proven IP and accelerates development.

Why Choose EP3SE260F1152C4LG?

The EP3SE260F1152C4LG places a high-capacity Stratix III FPGA in a compact FBGA package, delivering a combination of logic density, embedded memory and configurable power that suits demanding DSP, communications and embedded applications. Its selectable core voltage and family-level power-management features help designers balance throughput and power consumption within commercial temperature ranges.

This device is well suited for engineers building complex, memory‑rich systems who require a programmable, scalable platform with on-chip security and reliability features. The Stratix III family documentation and IP ecosystem support rapid integration and long-term design scalability.

Request a quote or submit an inquiry for pricing and availability of EP3SE260F1152C4LG to move your design forward.

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