EP3SE260F1152C4LN

The EP3SE260F1152C4LN is a Stratix® III E Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1152-ball BGA package. It provides a high-density logic fabric combined with substantial embedded memory and a large I/O complement for demanding commercial designs.

Key on-chip resources include 255,000 logic elements, approximately 16.67 Mbits of embedded memory, and 744 I/O pins. The device is supplied in a surface-mount 1152-FBGA (35×35) footprint, operates from 0 °C to 85 °C, and supports a core supply range of 860 mV to 1.15 V. It is RoHS compliant and graded for commercial use.

Key Features

• Core Logic Capacity  255,000 logic elements provide a high-density programmable fabric suitable for complex digital implementations.
• Embedded Memory  Approximately 16.67 Mbits of on-chip RAM enable memory-intensive algorithms and reduce reliance on external memory devices.
• I/O Resources  744 I/O pins support extensive interfacing and parallel connectivity for high-pin-count system designs.
• Package and Mounting  Supplied in a 1152-BBGA (1152-FBGA, 35×35) package for compact, high-density board-level integration; surface-mount mounting type.
• Power Envelope  Core supply range of 860 mV to 1.15 V allows designers to target power and performance trade-offs consistent with system requirements.
• Temperature and Compliance  Commercial operating range of 0 °C to 85 °C and RoHS compliance align the device with standard commercial product requirements.

Typical Applications

• High-density digital processing  Implements complex logic functions and custom datapaths using the device’s large logic element count.
• Memory-intensive FPGA designs  Uses the approximately 16.67 Mbits of embedded memory to support buffering, lookup tables, and on-chip storage needs.
• High-pin-count interface bridging  Leverages 744 I/O pins for parallel interfaces, board-level signal aggregation, and protocol bridging in commercial products.
• Commercial embedded systems  Fits into commercial-grade applications that require a combination of density, I/O capacity, and compact board footprint.

Unique Advantages

• High logic density:  255,000 logic elements enable implementation of large, integrated digital functions on a single device, reducing BOM complexity.
• Substantial on-chip memory:  Approximately 16.67 Mbits of embedded RAM supports internal buffering and state storage without immediate dependency on external memories.
• Extensive I/O count:  744 I/Os simplify board-level connectivity and reduce the need for additional interface components.
• Compact BGA footprint:  The 1152-FBGA (35×35) package provides a space-efficient solution for dense boards and multi-function modules.
• Commercial temperature and RoHS compliance:  Rated 0 °C to 85 °C and RoHS compliant, making it suitable for standard commercial products and regulatory environments.
• Flexible power range:  A core supply range of 860 mV to 1.15 V allows designers to tune power and performance characteristics to system needs.

Why Choose EP3SE260F1152C4LN?

The EP3SE260F1152C4LN positions itself as a high-capacity, commercially graded FPGA option for designs that demand large logic resources, significant embedded memory, and broad I/O capability in a compact BGA package. Its combination of 255,000 logic elements, approximately 16.67 Mbits of on-chip RAM, and 744 I/Os supports consolidation of functions that would otherwise require multiple components.

This device is appropriate for engineering teams working on commercial embedded products that need scalable logic density and high interfacing capacity while maintaining a compact PCB footprint. Its commercial temperature rating, RoHS compliance, and established Intel Stratix® III E architecture make it a practical choice for long-life production designs.

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