EP3SE260F1152C4N

The EP3SE260F1152C4N is a Stratix® III FPGA from Intel designed for high-density digital logic integration. It delivers a large logic fabric, substantial on-chip memory, and extensive I/O capacity in a 1152‑ball BGA package for surface‑mount assembly.

Targeted at commercial applications, this device is suited to designs that require up to 255,000 logic elements, approximately 16.7 Mbits of embedded memory, and up to 744 I/O connections while operating within a 0 °C to 85 °C range and a core supply of 0.86 V to 1.15 V.

Key Features

• Logic Capacity — 255,000 logic elements provide a high-density fabric for implementing complex combinational and sequential logic, large state machines, and custom datapaths.
• Embedded Memory — Approximately 16.7 Mbits of on‑chip RAM support buffering, frame storage, and local data structures without immediate external memory dependence.
• I/O Resources — Up to 744 I/O pins enable extensive peripheral interfacing, multi‑lane connectivity, and flexible board partitioning.
• Power and Core Supply — Operates from a core voltage range of 860 mV to 1.15 V, allowing integration into systems with modern low‑voltage power rails.
• Package and Mounting — 1152‑BBGA (Supplier device package: 1152‑FBGA, 35×35) surface‑mount package supports high pin‑count designs in compact board footprints.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C, suitable for a wide range of commercial electronics.
• Standards Compliance — RoHS‑compliant construction for regulatory and environmental compatibility.
• Platform Details — Part of the Stratix III family; the accompanying device documentation includes detailed sections such as DC and switching characteristics, PLL specifications, DSP block specifications, and TriMatrix memory block specifications to support design validation.

Typical Applications

• High‑density logic systems — Implements large custom digital systems that require hundreds of thousands of logic elements and significant on‑chip memory for intermediate data processing.
• Complex I/O aggregation — Serves as a central FPGA for designs needing extensive external device interfacing or multi‑lane connectivity using up to 744 available I/Os.
• Embedded data buffering — Uses approximately 16.7 Mbits of embedded memory for frame buffering, local caches, and data staging in real‑time systems.
• Custom compute and DSP — Leverages Stratix III device capabilities (documented DSP block specifications) for custom arithmetic accelerators and signal processing pipelines.

Unique Advantages

• High integration density: 255,000 logic elements and substantial on‑chip RAM reduce the need for external components and lower overall system BOM.
• Extensive I/O scalability: 744 I/Os allow flexible partitioning of peripherals, sensors, and high‑speed interfaces on a single device.
• Compact, manufacturable package: 1152‑BBGA (35×35) surface‑mount package supports automated PCB assembly and high pin count routing in a compact footprint.
• Design documentation available: Stratix III device handbook content includes DC/switching characteristics, PLL and DSP block specifications, and memory block details to aid system validation and integration.
• Regulatory compatibility: RoHS compliance meets environmental restrictions for many commercial product lines.
• Commercial operating range: Defined 0 °C to 85 °C temperature range aligns with typical commercial product requirements.

Why Choose EP3SE260F1152C4N?

The EP3SE260F1152C4N positions itself as a high‑capacity Stratix III FPGA for commercial designs that demand a combination of large logic resources, significant embedded memory, and broad I/O connectivity in a manufacturable BGA package. Its documented device characteristics and block specifications support detailed electrical and timing analysis during development.

This device is well suited for engineering teams building complex digital systems, custom compute or DSP accelerators, and I/O‑centric platforms that require a robust, high‑density programmable logic solution with clear operating and supply requirements.

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