EP3SE260F1152I4G

The EP3SE260F1152I4G is an Intel Stratix III family FPGA delivering high-density programmable logic and embedded memory for industrial-grade applications. It combines a large logic fabric with substantial on-chip RAM, flexible I/O, and industry-oriented thermal and voltage ranges to support complex digital signal processing, networking, and compute-acceleration tasks.

This device is designed for system integrators and engineers who need a high-capacity, RoHS-compliant FPGA in a 1152-FBGA package with surface-mount mounting and an industrial operating temperature range.

Key Features

• High Logic Capacity — 255,000 logic elements to implement large-scale digital designs and complex control logic.
• Embedded Memory — Approximately 16.67 Mbits of on-chip RAM (16,672,768 total RAM bits) for buffers, FIFOs, and data storage local to logic.
• Rich I/O — 744 user I/O pins in an FBGA package to interface with external memory, peripherals, and high-speed links.
• Performance & DSP — Stratix III family features include high-speed DSP/multiplier blocks and SERDES support for high-throughput signal processing (series-level capability referenced in the datasheet).
• Clocking & PLLs — Series architecture provides multiple global and regional clock resources and up to 12 PLLs for flexible clock management (series-level capability referenced in the datasheet).
• Security & Reliability — Stratix III series supports optional 256-bit AES encryption and configuration memory error detection and correction mechanisms (series-level capability referenced in the datasheet).
• Power & Core Voltage — Core supply range from 0.86 V to 1.15 V to match system power design and performance targets.
• Package & Thermal — 1152-FBGA (35×35) surface-mount package with industrial operating range of −40 °C to 100 °C.
• Compliance — RoHS compliant for environmentally conscious designs.

Typical Applications

• High-Performance Signal Processing — Use the device’s large logic capacity and embedded memory for FIR filters, FFT engines, and DSP pipelines.
• Networking & Telecom — Leverage FPGA SERDES and series-level I/O features for protocol handling, packet processing, and interface bridging.
• Memory Interface Controllers — Implement DDR/DDR2/DDR3 memory controllers and buffering logic using abundant on-chip RAM and modular I/O banks (series-level memory interface support referenced in the datasheet).
• Embedded System Acceleration — Offload compute-intensive tasks to hardware logic and DSP blocks to accelerate custom algorithms and data flows.

Unique Advantages

• Large, Programmable Fabric: 255,000 logic elements provide headroom for complex SoC-style integration and custom acceleration without immediate external ASIC development.
• Substantial On-Chip Memory: Approximately 16.67 Mbits of embedded RAM reduces dependence on off-chip memory for latency-sensitive buffering and FIFOs.
• Industrial Temperature Range: Rated from −40 °C to 100 °C, suitable for demanding environmental conditions encountered in industrial deployments.
• Flexible Integration: 744 I/O pins in a 1152-FBGA (35×35) package balance PCB routing density and external connectivity for complex systems.
• Power Versatility: Core supply from 0.86 V to 1.15 V enables design trade-offs between performance and power consumption.
• Proven Series Capabilities: Built on the Stratix III family architecture (series-level features include DSP blocks, PLLs, AES support, and configuration error detection), enabling advanced design options and system-level reliability features.

Why Choose EP3SE260F1152I4G?

The EP3SE260F1152I4G positions itself as a high-capacity, industrial-grade Stratix III FPGA option for applications requiring substantial programmable logic, on-chip memory, and robust I/O. Its combination of 255,000 logic elements, approximately 16.67 Mbits of RAM, and 744 I/O pins in an industrial-temperature, RoHS-compliant FBGA package makes it suitable for demanding signal processing, networking, and embedded acceleration tasks.

This device is appropriate for engineers and teams seeking a scalable, long-lived platform that aligns series-level Stratix III capabilities—such as advanced clocking, DSP resources, and security features—with part-specific electrical, thermal, and packaging specifications.

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