EP3SE260F1152I4LG

The EP3SE260F1152I4LG is an Intel Stratix III family FPGA supplied in a 1152‑ball FBGA package for surface-mount assembly. It delivers high logic density and substantial embedded memory for demanding digital signal processing, networking, and embedded control applications in industrial environments.

Built on the Stratix III architecture, the device emphasizes selectable core voltage and power-optimization features while providing a broad set of system-level capabilities exposed through abundant I/O, PLLs, and on-chip resources suitable for high-performance system integration.

Key Features

• Logic Capacity — Contains 255,000 logic elements to implement complex custom logic and state-machine designs.
• Embedded Memory — Approximately 16.7 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
• I/O and Package — 744 user I/O pins in a 1152‑FBGA (35×35) package; surface-mount configuration for compact PCB designs.
• Power and Core Voltage — Operates with a core supply range of 0.86 V to 1.15 V enabling selectable core voltage for performance vs. power trade-offs.
• Temperature and Grade — Industrial grade operation from −40°C to 100°C for robust performance in industrial applications.
• Stratix III Family Capabilities — Family-level features include programmable power technology, selectable core voltage, AES 256‑bit configuration encryption options, built-in error detection/correction for configuration and memory, multiple PLLs, and DSP/multiplier resources as described in the Stratix III device documentation.
• Standards and Compliance — RoHS compliant for reduced hazardous substance content.

Typical Applications

• High‑Performance DSP — Implement multichannel signal processing and filtering leveraging on-chip RAM and DSP resources for telecom, radar, and test equipment.
• Networking & Communications — Use large logic capacity and numerous I/O for protocol implementation, packet processing, and interface bridging in communications infrastructure.
• Memory Interface Controllers — Integrate custom memory controllers and buffering for external DDR/DDR2/DDR3 and other high‑speed memories using abundant embedded RAM.
• Industrial Control Systems — Deploy in motor control, factory automation, and instrumentation where industrial temperature range and surface-mount packaging are required.

Unique Advantages

• High Logic Density: 255,000 logic elements provide headroom for complex, multi‑function designs without immediate migration to larger devices.
• Substantial On‑Chip Memory: Approximately 16.7 Mbits of embedded RAM reduces external memory needs and simplifies board-level design.
• Flexible Power Scaling: Core voltage range (0.86–1.15 V) enables designers to balance performance and power consumption according to system requirements.
• Industrial Reliability: Specified for −40°C to 100°C operation and provided in a robust FBGA package suitable for industrial applications.
• System Integration: Family features such as multiple PLLs, configurable security, and on-chip error detection support complex system-level requirements and availability.
• Regulatory Compliance: RoHS compliance supports environmental and materials requirements for commercial and industrial products.

Why Choose EP3SE260F1152I4LG?

The EP3SE260F1152I4LG positions itself as a high-density Stratix III FPGA option for engineers needing significant logic resources, large embedded memory, and a broad I/O count in an industrial-temperature, surface-mount package. Its selectable core voltage and family-level power optimization features enable designers to tailor performance and power for specific applications.

This device is well suited for developers of signal processing, communications, and industrial control systems who require a balance of integration, reliability, and configurable security and clocking features documented in the Stratix III device family materials.

Request a quote or submit a pricing and availability inquiry for EP3SE260F1152I4LG to receive detailed purchasing information and lead-time options.