EP3SE260F1517C2

The EP3SE260F1517C2 is a Stratix® III E field programmable gate array (FPGA) IC from Intel, offered in a high-density FCBGA package. It provides a combination of large logic capacity, substantial on-chip memory, and a high I/O count for complex programmable logic designs operating in commercial temperature ranges.

Key Features

• Core Logic: 255000 logic elements available to implement complex digital functions and custom logic blocks.
• Embedded Memory: Approximately 16.7 Mbits of total on-chip RAM for buffering, state storage, and memory-intensive logic.
• I/O Density: 976 I/O pins to support wide parallel interfaces and high pin-count system integration.
• Power Supply: Operates from 860 mV to 1.15 V, enabling integration with low-voltage system power rails.
• Package & Mounting: 1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) designed for surface mount assembly.
• Operating Range: Commercial grade operation from 0 °C to 85 °C for standard environment deployments.
• Compliance: RoHS compliant, meeting common environmental directives for lead-free assembly.

Typical Applications

• High-density programmable systems: Use the 255000 logic elements and large embedded RAM to consolidate complex logic and memory functions on a single device.
• Wide-parallel interface designs: Leverage 976 I/Os for multi-channel data paths, parallel buses, and extensive peripheral connectivity.
• Embedded logic and control: Implement state machines, protocol handling, and control logic with ample on-chip resources and low-voltage operation.

Unique Advantages

• High logic capacity: 255000 logic elements enable dense implementation of complex algorithms and large-scale custom logic.
• Substantial on-chip RAM: Approximately 16.7 Mbits of RAM reduces external memory dependency and simplifies board-level designs.
• Extensive I/O availability: 976 I/Os provide flexibility for interfacing to multiple peripherals and high-bandwidth external systems.
• Compact FCBGA packaging: 1517-FBGA (40×40) package supports surface-mount integration for space-constrained designs.
• Low-voltage operation: 860 mV to 1.15 V supply range facilitates integration with modern low-voltage power domains.
• Commercial temperature and RoHS compliance: Suitable for standard commercial environments and lead-free manufacturing processes.

Why Choose EP3SE260F1517C2?

The EP3SE260F1517C2 is positioned for designs that require high logic density, significant on-chip memory, and a large number of I/Os within a compact FCBGA footprint. Its combination of 255000 logic elements, approximately 16.7 Mbits of embedded RAM, and 976 I/Os offers a balanced platform for complex programmable logic applications at commercial operating temperatures.

For development teams and procurement focused on consolidating functionality, reducing external memory needs, and supporting wide-parallel interfaces, this FPGA delivers the on-chip resources and packaging options to streamline board design and assembly.

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