EP3SE260F1517C2N

The EP3SE260F1517C2N is a Stratix® III E Field Programmable Gate Array (FPGA) from Intel, delivered in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. It provides a large logic fabric and abundant I/O for designs that require extensive programmable logic and on-chip memory.

With 255,000 logic elements, approximately 16.7 Mbits of embedded memory, and 976 I/O pins, this commercial-grade FPGA targets high-density digital systems where integration of logic, memory and I/O reduces board-level complexity.

Key Features

• Core Logic – 255,000 logic elements complemented by 10,200 CLBs to implement large, complex digital functions and state machines.
• Embedded Memory – Approximately 16.7 Mbits of on-chip RAM for buffering, FIFOs, and local data storage to support data-path and control logic.
• I/O Capacity – 976 user I/Os to connect wide parallel buses, multiple high-pin-count interfaces, or dense peripheral arrays directly to the FPGA fabric.
• Power – Core operating voltage range of 0.86 V to 1.15 V to match system power rails and enable predictable power budgeting.
• Package & Mounting – 1517-BBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for use in compact, high-density boards.
• Operating Range & Grade – Commercial grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant for regulatory alignment.

Typical Applications

• High-density digital systems – Implement wide datapaths, complex state machines, and protocol logic using the large pool of logic elements and CLBs.
• I/O-intensive interfaces – Integrate and aggregate numerous parallel or multiplexed signals using the 976 available I/Os.
• Embedded memory buffering – Use the on-chip RAM for buffering, packet queues, and temporary data storage in data-path applications.
• Prototyping and system integration – Consolidate multiple discrete functions into a single, programmable device to reduce BOM and board complexity.

Unique Advantages

• Large logic capacity: 255,000 logic elements provide the headroom needed for complex custom logic blocks and feature-rich implementations.
• Extensive on-chip memory: Approximately 16.7 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Massive I/O availability: 976 I/Os enable direct interfacing to numerous peripherals and high-pin-count buses without extensive external multiplexing.
• Compact board footprint: 1517-BBGA surface-mount package supports dense PCB layouts while maintaining high integration.
• predictable power envelope: Defined core voltage range (0.86 V–1.15 V) helps with power supply planning and thermal design.
• Regulatory alignment: RoHS compliance supports use in designs requiring lead-free soldering and environmental compliance.

Why Choose EP3SE260F1517C2N?

The EP3SE260F1517C2N delivers a combination of large logic resources, substantial embedded memory, and one of the highest I/O counts available in its package class, making it suitable for dense digital designs where integration and I/O scalability matter. Packaged in a 1517-BBGA surface-mount footprint and offered as a commercial-grade device, it fits applications requiring significant on-chip capability within standard operating-temperature environments.

Designed as part of the Stratix® III E family from Intel, this FPGA provides predictable hardware resources for teams looking to consolidate functions, reduce BOM complexity, and scale designs that demand wide I/O and embedded RAM capacity.

Request a quote or submit a procurement inquiry to evaluate EP3SE260F1517C2N for your next high-density FPGA design.