EP3SE260F1517C4

The EP3SE260F1517C4 is a Stratix® III E field programmable gate array (FPGA) offered by Intel, targeted at commercial electronic systems. The device provides a high count of programmable logic, substantial embedded memory, and a large number of I/O pins to support dense, I/O-rich designs.

With a defined core voltage range and commercial temperature grade, this surface-mount FCBGA package is intended for designs that require concentrated logic capacity and on-chip RAM within a 40×40 1517-FBGA footprint.

Key Features

• Logic Capacity  255,000 logic elements and 10,200 configurable logic blocks (CLBs) to implement complex programmable logic functions.
• Embedded Memory  Approximately 16.7 Mbits of on-chip RAM for buffering, lookup tables, and embedded data storage.
• I/O Density  976 general-purpose I/O pins to support extensive external interfacing and parallel connectivity.
• Power and Core Voltage  Core supply voltage range of 0.86 V to 1.15 V to match modern low-voltage power architectures.
• Package and Mounting  1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for board-level integration.
• Operating Temperature  Commercial temperature range from 0 °C to 85 °C suitable for a wide range of commercial deployments.
• Compliance  RoHS-compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Commercial embedded systems — Implement high-density programmable logic and on-chip memory for feature-rich commercial products.
• I/O consolidation and protocol bridging — Use the device’s 976 I/Os to aggregate interfaces and implement protocol translation or glue logic.
• Prototyping and system development — Employ the large logic and memory resources for development of complex digital designs and system prototypes.

Unique Advantages

• High logic density: 255,000 logic elements enable implementation of large, complex logic functions without immediate need for external logic chips.
• Substantial embedded RAM: Approximately 16.7 Mbits of on-chip memory reduces dependence on external RAM for buffering and temporary storage.
• Extensive I/O capability: 976 I/Os support broad connectivity requirements and simplify board-level interface design.
• Compact FCBGA package: The 1517-FBGA (40×40) footprint allows high integration in space-constrained PCB layouts.
• RoHS compliance: Meets environmental manufacturing expectations for commercial products.
• Commercial grade operation: Rated for 0 °C to 85 °C to suit typical commercial deployment environments.

Why Choose EP3SE260F1517C4?

The EP3SE260F1517C4 positions itself as a high-capacity, highly integrated FPGA option for commercial designs that require substantial logic, memory, and I/O resources in a surface-mount FCBGA package. Its combination of 255,000 logic elements, approximately 16.7 Mbits of embedded RAM, and 976 I/Os supports consolidated designs that benefit from on-chip integration.

Manufactured by Intel and provided in a compact 1517-FBGA package with a defined core voltage range and commercial temperature rating, this FPGA is suitable for engineering teams building complex programmable logic solutions for commercial electronic products.

Request a quote or submit an inquiry for pricing and availability of the EP3SE260F1517C4 to evaluate it for your next commercial FPGA design.