EP3SE260F1517C4LN

The EP3SE260F1517C4LN is a commercial-grade Stratix® III E field programmable gate array (FPGA) from Intel, designed for high-density, board-mounted digital designs. It combines a large logic capacity and substantial embedded memory with a high pin count and a compact 1517-BBGA (40×40 FCBGA) package for surface-mount applications.

Targeted at commercial applications, this device offers a balance of integration and scalability for complex digital processing, interface bridging, and system-level prototyping where high logic density and significant on-chip RAM are required.

Key Features

• Logic Capacity — 255,000 logic elements provide the programmable resources required for complex digital functions and custom logic implementations.
• Embedded Memory — Approximately 16.7 Mbits of on-chip RAM to implement buffers, FIFOs, and distributed memory structures without external RAM.
• I/O Density — 976 general-purpose I/O pins to support wide parallel buses, multiple high-pin-count interfaces, and extensive signal routing on the board.
• Power Supply Range — Core voltage supply from 0.860 V to 1.15 V to match system power architectures and regulator choices.
• Package & Mounting — 1517-BBGA (1517-FBGA, 40×40) package for surface-mount PCB assembly, enabling compact board layouts and high pin density.
• Operating Range & Grade — Commercial-grade device rated for operation from 0 °C to 85 °C, suitable for business, consumer, and many industrial-adjacent electronics environments.
• Regulatory Compliance — RoHS compliant, supporting lead-free assembly and environmentally conscious designs.

Typical Applications

• High-density digital processing: Use the 255,000 logic elements and ~16.7 Mbits of embedded memory to implement complex signal processing, protocol handling, and custom compute blocks on a single device.
• Interface aggregation and bridging: Leverage 976 I/O pins to connect multiple parallel buses, translate between protocols, or aggregate high-pin-count peripherals.
• System prototypes and product development: Compact 1517-BBGA surface-mount package and broad logic capacity make this FPGA suitable for development boards and pre-production hardware.

Unique Advantages

• High programmable density: Large logic element count enables consolidation of multiple functions into a single FPGA, reducing board-level BOM and interconnect complexity.
• Substantial on-chip memory: Approximately 16.7 Mbits of embedded RAM reduce dependence on external memory components and simplify timing and PCB routing.
• Extensive external connectivity: Nearly 1,000 I/O pins permit flexible system I/O assignment and support for multiple parallel interfaces without external multiplexing.
• Compact, board-friendly package: 1517-BBGA (40×40 FCBGA) surface-mount footprint helps maximize routing density while keeping the overall PCB area manageable.
• Commercial-grade operating range: Rated 0 °C to 85 °C for reliable operation across typical commercial environments and product deployments.
• RoHS compliant: Supports lead-free manufacturing and environmental compliance goals.

Why Choose EP3SE260F1517C4LN?

The EP3SE260F1517C4LN positions itself as a high-capacity, commercially graded FPGA option for designs that require substantial programmable logic, on-chip memory, and extensive I/O in a compact surface-mount package. Its combination of 255,000 logic elements, approximately 16.7 Mbits of embedded RAM, and 976 I/Os delivers a platform capable of consolidating complex system functions and reducing external component count.

This device is well suited for engineering teams and OEMs building advanced digital systems, interface-heavy boards, or prototype platforms that benefit from a scalable FPGA architecture, compact 1517-BBGA footprint, and RoHS compliance for streamlined manufacturing.

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